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How to design a 40-billion-transistor SoC (and live to tell the tale)

April 6, 2010

Keynoting the Mentor Graphics U2U meeting in Santa Clara this morning, Mentor chairman and CEO Wally Rhines delivered one of his signature tightly-reasoned essays on the future of IC design and what we might do about it. The topic was, roughly, SoC design in 2018.

Rhines started with his frequent observation that Moore’s Law is actually not a law, but more of an observation. And at that, it is a particular case of a learning curve: that nearly universal law of human endeavor that mandates a linear relationship between the log of unit cost and the log of cumulative volume. Extrapolating from the days of vacuum tubes through the ups and downs of recent years and into the dark sub-nanometer future, Rhines pegged the headline chips of 2018 at 40 billion transistors each.

But then the executive pointed out that the time interval from introduction to production-worthy use for a major new EDA technology has always been about eight years. So in all likelihood, the EDA tools that produce those 40 billion transistors will have to use technology that is just coming to market today. Rhines took a quick stroll down the chip design flow to show how productivity improvements at each stage could make this possible.

His first stop was the system level, where Rhines predicted a shift to transaction-level design, using models that the users can create for themselves. This work, he suggested could be done in any of a number of environments that are already in limited use for system modeling and synthesis in the software world, including UML, SysUML, and the automotive industry’s autoSAR.

For verification, Rhines said we would need at least a three order-of-magnitude increase in productivity. Then he listed steps that could get us there: hardware emulation, the ploy of simply eliminating redundant simulation runs during verification, the use of transactional test benches, and learning to blend simulation, emulation, and formal verification into a single approach. Taken together, these steps, all of which would rest on groundwork that exists today, could improve verification productivity by anywhere from three orders of magnitude to 14, Rhines estimated.

Turning to physical design, Rhines observed that about every two and a half years the problems of placement, routing, and analysis become sufficiently more complex that some start-up comes along and rewrites the rules. This happened most recently, he suggested, with techniques for doing simultaneous multi-corner, multi-mode analyses, and with the use of threading to adapt analysis tools to small numbers of cores. The next step, Rhines said, would be a tight integration of routing code with design-rule and design-for-manufacturing analyses, eliminating the need for physical-design respins to accommodate DRC ECOs. In addition, this integrated router will be parallelized—as has already been done with board-level routers—providing nearly-linear performance scaling on up to dozens of CPU cores.

Finally, Rhines addressed the submerged nine-tenths of the development berg: software development. By applying existing ideas—design re-use, software design automation, and open-standard packages for operating systems and middleware—Rhines said, the now mostly hand-crafted world of embedded software development could achieve the necessary gains in productivity to keep it from being a game-ending problem.

With that, Rhines rested his case, having shown that in every major stage of the development cycle it was possible to use today’s new ideas to achieve a factor of a thousand improvement in productivity. If you were keeping score, you might note that he did not mention synthesis, quietly leaving no additional step in between transaction-level system modeling and verification. That ellipsis might very well point us to a Mentor strategy aimed at compensating for their relative absence from today’s RTL synthesis market.

Posted by Ron Wilson on April 6, 2010 | Comments (6)

April 9, 2010
In response to: How to design a 40-billion-transistor SoC (and live to tell the tale)
garydpdx commented:

A good point on EDA tools by The DEB ... the Big 3 have hunkered down due to the Great Recession and consequences of a broken business model diluting revenue (enterprise software - works for Oracle, SAP or CA but no longer for EDA). Meanwhile, most innovation has been driven by start-ups but venture funding has dried up, coupled with lack of exits or IPO (see again, Big 3 and Great Recession). I mean, there was only one EDA IPO in the last couple of years and that was Magillem in France, which went under- or unreported at the end of 2009.


April 8, 2010
In response to: How to design a 40-billion-transistor SoC (and live to tell the tale)
M. Simon commented:

Green Arrays is doing some interesting work in this area with it GA144 (144 cores) processor and a data flow architecture. Power management is automatic - no data? Sleep. Data? Wake up in a few ns.


April 8, 2010
In response to: How to design a 40-billion-transistor SoC (and live to tell the tale)
The Digital Electronics Blog commented:

2018 is just too much to think in this industry. What we should be thinking is just 2 years ahead and build better tools and train people to use them. Unfortunately, the EDA tools have not evolved to the expectations of the industry.


April 8, 2010
In response to: How to design a 40-billion-transistor SoC (and live to tell the tale)
Jyri Poldre commented:

Let us jump into future. Imagine that the tools are available together with technology. The question then is where are the pilots? The level of expertize required in technical and administrative field requires similar orders of magnitude improved quality lifetime for longer learning curves. Also the process has to be justified - it is possible to purchase Gulfstream jet today and learn to fly it but how many of us have sufficient motivation, talent and means to really get there?


April 7, 2010
In response to: How to design a 40-billion-transistor SoC (and live to tell the tale)
Bill Martin commented:

As we keep pushing the 2D homogeneous solutions, costs will continue to skyrocket for chip design and continue the downward design start trend. As 3D die stacking via bond wires or TSVs prove themselves in reliability and cost/performance metrics, this trend might actually reverse itself allowing many more players to innovate and create small ICs that use best process for their requirements rather than using a 'one size fits all' process. Besides enabling many 'IP' creators it will also help fund many niche fabs with optimized processes. In this scenario, rather than integrating all into 1 expensive, large die hoping that all components work, smaller ICs can already be available and proven waiting for the 'custom' chip to be completed. This 'custom' chip might be an FPGA-like chip even cutting down the costs and time to develop or respin. Just imagine if you had a large FPGA design that had built in TSVs and a flow that could enable fast prototyping with separate, packaged units. When validated, you provide the die back to your FPGA vendor (or one of their trusted 3rd party 'integrators' and they combine the FPGA + die into a 3D solution. Are there issues with the above? Yep. But it could lead to some very interesting design platforms and new tools and methods. Another evolution in reuse.


April 7, 2010
In response to: How to design a 40-billion-transistor SoC (and live to tell the tale)
Concerned_Designer commented:

What he did not mention is that at each design node the number of design starts is decreasing. This is being driven by the cost of development and production at these very high density nodes. The fundamental question in my mind is not if it can be done but will there by any designs to do that will provide an adequate return on the investment. "Design starts are shrinking at a faster pace, going from 1012 65 nm system-on-chip (SoC) design starts to 562 at the 45/40 nm generation, 244 32/28 nm tapeouts, and only 156 22 nm design starts, said Subramani Kengeri, vice president of design solutions at GlobalFoundries, quoting predictions from International Business Strategies and Mentor Graphics." www.semiconductor.net/article/453209-GlobalFoundries_TSMC_Square_Off_at_DATE-full.php

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