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  • OEM-ready wireless sensor site launches
    Steve Taranovich, Senior Technical Editor, April 26, 2012
    Monnit Corporation has launched OEMSensors.com with a new line of OEM-ready wireless sensors, gateways and back-end monitoring software targeting broad lines of commercial, industrial and M2M applications. More
  • Understanding the basics of setup and hold time
    Deepak Behera, Karthik Rao C.G. and Deepak Mahajan, Freescale Semiconductor, April 19, 2012
    Setup and hold times are treated as intrinsic properties of an element. However, it is the very existence of setup and hold time that often confuses us. Here are the cause of setup and hold time within a sequential element (flip-flop) and a look at the operation of the flop. More
  • EMI problems? Part three: strength of EMI-radiated signals
    Bonnie Baker, Texas Instruments, April 19, 2012
    Now that we have identified EMI sources we are going to see what happens as the signals are radiated towards your boards. More
  • Smack attack
    Terry Staler, Specialty Concepts Inc, April 19, 2012
    Amid a maze of wires, a junior engineer must find out why his company's telephone-usage-monitoring equipment is failing. More
  • Low-voltage motor drivers suit battery-powered applications
    Steve Taranovich, Senior Technical Editor, April 18, 2012
    Stepper, brushed DC motor drivers reduce power consumption and board space. More
  • Design calculations for robust I2C communications
    Chris Parris, Senior Applications Engineer and Jonathan Dillon, Senior Applications Engineer, Memory Products Division, Microchip Technology Inc., April 18, 2012
    The I2C bus topology relies on correctly sized resistance pull-ups for reliable, robust communications. Getting these values wrong can lead to erroneous bus conditions and transmission errors caused by noise or changes in temperature and operating voltages, and by variations between devices. More
  • New power semiconductor technologies challenge assembly and system setups
    Dr. Gerhard Miller, Infineon Technologies, Neubiberg Am Campeon, Germany, April 16, 2012
    While power density and performance rise, higher current densities require operating temperatures up to 200° C and faster switching to prevent losses, assemblies and system setups can't cope. Taking advantage of improved electrical properties requires thermal and electrical assembly technologies featuring very low stray inductances with a 10x to 20x better load-cycling capability at a higher temperature swing. More
  • 18-bit, 2.5Msps SAR ADC achieves no latency
    Steve Taranovich, Senior Technical Editor, April 13, 2012
    Provides 99.8dB SNR with flexible analog input ranges. More
  • Compliance with POE safety standards is critical when moving beyond 60W
    Daniel Feldman, Microsemi Corp, April 5, 2012
    Understand the realities of safely and effectively delivering high power levels that comply with the latest POE standard. More
  • Optically isolating an I2C interface: Beware of nonlinear propagation delays
    Eric D. Blom, Senior Design Engineer, IXYS-Clare Inc., April 3, 2012
    The usual model of an I2C open-drain bus as a simple, shared pull-up resistor is not instantaneously valid when using bus isolators exhibiting real-world propagation delays. If the delays are not considered in the design of the hardware, then there can be unexpected consequences. More
  • Slideshow: DESIGN West 2012 photos
    EDN staff, March 28, 2012
    View a slideshow of the activities engineers experienced at DESIGN West 2012. These included brain-teasers, artistic renderings, in-booth popular seminars, impressive demos, events, and keynotes.
    More
  • ACE Awards 2012: Celebrating excellence in engineering
    EDN staff, March 27, 2012
    The UBM Electronics ACE (Annual Creativity in Electronics) Awards combine EDN's Innovation Awards and EE Times' ACE Awards and are among the few chances for us to honor the best of the best individuals, teams, teachers, mentors, innovators, products, technology, and creativity that propel our industry forward. More
  • ACE AWARDS ULTIMATE PRODUCTS of 2011
    Rich Pell, Executive Editor, March 27, 2012
    The ACE Awards program is an opportunity to recognize the technologies that have made a difference in the way we work, live and play. Nothing exemplifies this more than the winners of this year's ACE Awards for Ultimate Products of the Year. More
  • ACE AWARDS STUDENT OF THE YEAR: Aaron Goldstein
    Suzanne Deffree, Managing Editor, Online, March 27, 2012
    Understanding both the value and the challenges of collaboration, Goldstein values his peers as much as he values those who have helped guide his early career. More
  • ACE AWARDS MENTOR OF THE YEAR: Stewart Christie
    Suzanne Deffree, Managing Editor, Online, March 27, 2012
    Christie is the first recipient of the Mentor of the Year Award, which made its premier at this year's ACE Awards ceremony. The award came about in recognition of those engineers and executives who take action to inspire and encourage the STEM (science/technology/engineering/math) leadership of tomorrow. More
  • ACE AWARDS LIFETIME ACHIEVEMENT: James Truchard, PhD, and Jeff Kodosky
    Patrick Mannion, Director of Content, March 27, 2012
    By definition, the EE Times/EDN Lifetime Achievement Award goes to an individual or individuals whose contributions over a career in electronics have had a demonstrable effect on technological, business, and cultural advancements. This year's winners, co-founders of National Instruments, epitomize the spirit of the award. More
  • Electric vehicle battery management system displayed at DESIGN West
    Steve Taranovich, Senior Technical Editor, March 27, 2012
    Road-ready BMS demonstrated in Nuvation's street-legal E.Rex EV. More
  • Adapteva close to sampling 28-nm, 64-core coprocessor
    Peter Clarke, EE Times, March 19, 2012
    Adapteva, a small and lean fabless startup that has developed a series of multicore floating-point processors, claims its latest device, a 28-nm 64-core processor is close to sampling. More
  • EMI problems? Part two: Where does EMI come from?
    Bonnie Baker, Texas Instruments, March 15, 2012
    EMI or RFI signals are all around us. You can stop these signals at their source or just let them go. If you do let them go, there is a possibility that someone will find out about it with their equipment. More
  • Hidden interfaces: a new playground for embedded innovations
    Robert Cravotta, Embedded Insights Inc, March 15, 2012
    New interfaces can detect users’ presence and motion. In response, designers are providing new features to make their systems more responsive to users’ needs. More
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