IC Design
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New power semiconductor technologies challenge assembly and system setupsDr. Gerhard Miller, Infineon Technologies, Neubiberg Am Campeon, Germany, April 16, 2012While power density and performance rise, higher current densities require operating temperatures up to 200° C and faster switching to prevent losses, assemblies and system setups can't cope. Taking advantage of improved electrical properties requires thermal and electrical assembly technologies featuring very low stray inductances with a 10x to 20x better load-cycling capability at a higher temperature swing. More
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Samplify solutions transform processing paradigms at DESIGN West 2012Steve Taranovich, Senior Technical Editor, April 12, 2012Samplify Systems Inc, a provider of IP solutions, improves multicore I/O bottlenecks/cloud computing (heading off the multicore memory wall), consumer electronics, mobile devices, and supercomputer capacity. More
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Optically isolating an I2C interface: Beware of nonlinear propagation delaysEric D. Blom, Senior Design Engineer, IXYS-Clare Inc., April 3, 2012The usual model of an I2C open-drain bus as a simple, shared pull-up resistor is not instantaneously valid when using bus isolators exhibiting real-world propagation delays. If the delays are not considered in the design of the hardware, then there can be unexpected consequences. More
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ACE Awards 2012: Celebrating excellence in engineeringEDN staff, March 27, 2012The UBM Electronics ACE (Annual Creativity in Electronics) Awards combine EDN's Innovation Awards and EE Times' ACE Awards and are among the few chances for us to honor the best of the best individuals, teams, teachers, mentors, innovators, products, technology, and creativity that propel our industry forward. More
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ACE AWARDS MENTOR OF THE YEAR: Stewart ChristieSuzanne Deffree, Managing Editor, Online, March 27, 2012Christie is the first recipient of the Mentor of the Year Award, which made its premier at this year's ACE Awards ceremony. The award came about in recognition of those engineers and executives who take action to inspire and encourage the STEM (science/technology/engineering/math) leadership of tomorrow. More
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ACE AWARDS DESIGN TEAM OF THE YEAR: Tilera's Tile-architecture design teamPatrick Mannion, Director of Content, March 27, 2012The Design Team of the Year Award goes to a group of innovators whose collaborative efforts made a significant contribution to the evolution of technology and whose project-management abilities are creative, efficient, and inspiring. More
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EMI problems? Part two: Where does EMI come from?Bonnie Baker, Texas Instruments, March 15, 2012EMI or RFI signals are all around us. You can stop these signals at their source or just let them go. If you do let them go, there is a possibility that someone will find out about it with their equipment. More
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Hidden interfaces: a new playground for embedded innovationsRobert Cravotta, Embedded Insights Inc, March 15, 2012New interfaces can detect users’ presence and motion. In response, designers are providing new features to make their systems more responsive to users’ needs. More
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Tensilica's Chris Rowen: hooked on electronicsInterview conducted and edited by Ann Steffora Mutschler, March 15, 2012Chris Rowen, PhD, the first president of Tensilica Inc, is the company’s founder, chief technology officer, and a member of the board. The RISC guru spoke with EDN about how he became interested in engineering, what engineering students need to know, and the biggest challenges facing SOC design for today’s advanced applications. More
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Hard mask development taps use of nanocrystalsNicolas Mokhoff, EE Times, March 7, 2012Pixelligent, a provider of nanocrystal additives, and Brewer Science are using their nanocrystal and microelectronic coating technologies to create a next-generation spin-on hard mask for semiconductor lithography processes. More
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Cadence moves physical design software to 20 nmPeter Clarke, EE Times, March 5, 2012Cadence Design Systems Inc has announced that the latest release of its Encounter software suite for RTL-to-GDSII design supports the 20-nm manufacturing process technology node. More
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Addressing critical-area analysis and memory redundancySimon Favre, Mentor Graphics, March 1, 2012How susceptible is your design to random defects, and which areas of the layout could benefit from modifications that would provide the greatest positive effect on overall yield? More
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Smart wireless for your worldPallab Chatterjee, Contributing Technical Editor, March 1, 2012The luxury of RF is now a required component. As a result, what is considered RF is forever changed. More
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Getting around multicore walls: The roads less traveledLoring Wirbel and Lou Covey, New Tech Press, February 23, 2012The processor industry has been running pell mell down the road of multicore design. But a funny thing happened on the way to the personal super computer. It didn't work. More
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Terahertz CMOS debuts at ISSCCR Colin Johnson, EE Times, February 22, 2012Accomplished under SRC's Focus Research Program, the demonstration of terahertz speeds on standard CMOS opens a door for a new slew of consumer devices that can see through solid objects. More
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Intel confirmed as foundry for second FPGA startupDylan McGrath, EE Times, February 21, 2012Tabula becomes the second programmable logic startup confirmed to be using Intel's Custom Foundry division for foundry work. More
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EMI problems? Just the facts, pleaseBonnie Baker, Texas Instruments, February 16, 2012EMI or RFI sources continue to become more prevalent in our world. This type of noise can invade even the low frequency analog circuits. The source of this radiated noise interference can be found wherever electric or magnetic fields exist. More
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Future of computing - Part 3: The ILP Wall and pipelinesRussell Fish III, February 14, 2012In Part 3 of his look at the future of computing, processor expert Russell Fish III analyzes the problem of the "parallelism wall." More
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Synopsys tips 28-nm HDMI 1.4 PHY IPEE Times staff, February 14, 2012EDA and IP vendor Synopsys has announced the immediate availability of DesignWare HDMI (High-Definition Multimedia Interface) 1.4 PHY IP in advanced 28-nm processes for multiple leading foundries. More
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Kodak's travails provide multiple lessonsBill Schweber, Contributing Technical Editor, February 2, 2012Markets and technologies that once looked as though they would last forever sometimes do not. More
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