News Center
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Intel's FinFETs are less fin and more triangleEE Times staff, May 17, 2012Reverse engineering and analysis consultancy Chipworks Inc has posted microscope cross-sections of parts of the 22-nm Ivy Bridge processor from Intel that has revealed that the FinFETs, which Intel calls tri-gate transistors, are in fact trapezoidal, almost triangular, in cross-section. More
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Farnell element14 Cadsoft Eagle design contest opensBernard Cole, May 17, 2012Electronic design engineers and enthusiasts will need to submit their innovative design projects to win prizes with a pot value of $7000. More
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Former Apple, Google, Facebook engineers launch IoT startupPeter Clarke, EE Times, May 16, 2012Electric Imp Inc has developed a Wi-Fi node in a memory card physical format that it hopes will become a standard technique for assigning IP addresses and linking to the Internet to establish a Wi-Fi-mediated IoT. More
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GSA spies venture capital investment uptick in AprilPeter Clarke, EE Times, May 16, 2012Investment in semiconductor industry startup and private companies jumped up in April to $194.2 million, according to the Global Semiconductor Alliance industry body. More
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Will China hit a (great) wall? Don't bet on itGeorge Leopold, EE Times, May 16, 2012There's a fashionable theory making the rounds here that China's booming manufacturing economy will soon "hit a wall" just as did the export-driven Japanese economy in the early 1990s. More
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AMD's fires Trinity in x86 notebook battleRick Merritt, EE Times, May 15, 2012Advanced Micro Devices officially launched its 32-nm Trinity processors, going head-to-head in notebooks and desktops with Intel's 22-nm Ivy Bridge CPUs. More
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NSF's I-Corps targets 'innovation ecosystem'George Leopold, EE Times, May 15, 2012A new public-private effort aimed at strengthening the US "innovation ecosystem" seeks to leverage promising technologies emerging from university labs so that they can quickly be turned into products. More
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Test equipment market snapshotJanine Love, May 14, 2012Grab your lunch and head to Frost&Sullivan's webinar on the test equipment market. More
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Four reasons why MIPS new cores may make it relevant againJunko Yoshida, EE Times, May 14, 2012With the new cores' smaller die size and reduced energy consumption compared to ARM's midrange core like A15, MIPS is hoping that the new family of cores can put the company back on track. More
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Intel drives Xeon server CPU to 17WRick Merritt, EE Times, May 14, 2012Intel launched the first server CPUs using its 22-nm tri-gate technology, including a new 17W part aimed at the emerging micro-server segment. The x86 giant also rolled out new 32-nm server chips, including an entry-level part that narrows AMD's price lead in four-socket servers. More
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Netronome reduces SoC power use with timing tricksNicolas Mokhoff, EE Times, May 14, 2012Cadence Design Systems claims that Netronome designers achieved a 29% reduction in power consumption using Cadence's latest Encounter 11.1 technology thereby providing performance advantage on its low-power "green" SoCs targeting the secure virtual cloud and data center markets. More
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Indy engines still pack a 700-HP punchCharles Murray, Design News, May 11, 2012This year, when the Indy cars line up in the grid at the "greatest spectacle in racing," they'll be using engines with less displacement than that in a Volkswagen Golf or a Toyota Camry. More
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ARM dominates 10B unit CPU core marketRick Merritt, EE Times, May 10, 2012Driven by the growth of mobile devices, merchant CPU cores shipped in more than 10 billion chips last year, up 25% over 2010, according to a new report. More
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OpenFlow debuts on an optical networkRick Merritt, EE Times, May 10, 2012The move to software-defined networks passed another milestone as ADVA Optical Networking demonstrated the OpenFlow specification for the first time on an optically switched network. More
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Infineon, Fuji agree on HybridPACK 2 automotive power module specsChristoph Hammerschmidt, May 10, 2012At the PCIM Europe trade show in Nuremberg, the two companies announced their agreement on a joint common footprint for automotive IGBT power modules using Infineon's Hybrid PACK 2 power module. More
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Nvidia contributes CUDA compiler to open sourceDylan McGrath, EE Times, May 9, 2012LLVM, a popular open source compiler, now supports Nvida GPUs. More
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Sequans tips interference mitigation technology for LTEDylan McGrath, EE Times, May 9, 2012French wireless communications chip vendor Sequans Communications said it added a new interference mitigation algorithm to its LTE chip platforms that the company says can increase throughput by more than three-fold and can increase network capacity by up to two fold. More
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Synopsys buys photonics design tool firmDylan McGrath, EE Times, May 9, 2012EDA and IP vendor Synopsys said it completed the acquisition of RSoft Design Group, a provider of photonics design and simulation software. Financial terms of the deal were not disclosed. More
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Fraunhofer makes mini-projector for smartphonesChristoph Hammerschmidt, May 8, 2012Researchers at the German research institution Fraunhofer IOF have developed an array of hundreds of microprojectors that can be used to project images from smartphones and similar small devices. The array enables the design of slim LED projection systems, which nevertheless offer bright images even on curved screens. More
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Baolab plans monolithic inertial MEMSPeter Clarke, EE Times, May 8, 2012Baolab Microsystems SL (Barcelona, Spain), a startup pioneering the creation of MEMS within the metal interconnect layers of CMOS wafers, has announced that it is planning to use its technology to build reconfigurable inertial measurement units. More
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