Semiconductor Manufacturing
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Luxtera, ST in deal to take silicon photonics mainstreamPeter Clarke, EE Times, February 29, 2012STMicroelectronics has agreed with CMOS photonics specialist Luxtera to develop a dedicated silicon photonics process at its 300-mm research and pilot production wafer fab in Crolles, France. More
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EU project boosts OPV for solar power generationAnne-Françoise PELE, EE Times, February 22, 2012The Swiss Center for Electronics and Microtechnology (CSEM SA) has launched a four-year, 14.2 million euro ($18.8 million) project that aims to develop highly efficient, long-lasting, inexpensive, and environmentally friendly printed organic photovoltaics (OPV). More
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Intel confirmed as foundry for second FPGA startupDylan McGrath, EE Times, February 21, 2012Tabula becomes the second programmable logic startup confirmed to be using Intel's Custom Foundry division for foundry work. More
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Analyst ranks chip markets by 2012 growth predictionPeter Clarke, EE Times, February 14, 2012With numerous changes from 2011, some 27 IC product areas out of 33 defined by the World Semiconductor Trade Statistics organization will see market growth in 2012, according to market research firm IC Insights Inc. More
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Maskless e-beam litho good for 14-nm , says CEA-LetiPeter Clarke, EE Times, February 13, 2012French research institute CEA-Leti has said that 22-nm lines and spaces have been created using direct-write e-beam lithography technology and that the demonstrated resolution meets the requirements for both 14- and 10-nm logic processing nodes. More
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Plastic memory firm signs partners for printed systemsPeter Clarke, EE Times, January 24, 2012Thin Film Electronics has joined forces with a number of partners to develop a low-cost printed electronic sensor platform that could be used to monitor the temperature of perishable goods such as food and pharmaceuticals. More
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Soitec, Sumitomo offer 'smart-cut' GaN wafersPeter Clarke, EE Times, January 24, 2012Semiconductor manufacturing materials vendors Soitec and Sumitomo Electric Industries have announced that they have demonstrated four- and six-inch diameter engineered gallium nitride (GaN) wafer substrates and the launch of pilot production to enable wider market adoption. More
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Teardown: The power inverter - from sunlight to power gridSteve Taranovich, Contributing Editor, January 13, 2012This teardown of a solar inverter card traces the path of harvested DC power from the photovoltaic panel, through boost conversion, power inverter and massive filtering of the created AC power signal required by the power grid. Surrounded by monitoring and microcontroller magic along with safety standard adherence, we uncover the mysteries of solar energy harvesting electronics. More
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Imec is collaborating with Flamac on novel PV materialsNicolas Mokhoff, EE Times, December 21, 2011More
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IBM, Micron to build hybrid memory with TSVsEE Times staff, November 30, 2011Micron Technology Inc's hybrid memory cube (HMC) will become the first commercial CMOS manufacturing technology to employee IBM Corp's through-silicon via (TSV) process. More
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IBM tries running datacenters on solar powerBy Sylvie Barak, EE Times, November 22, 2011IBM is harnessing the power of the sun with a massive installation of a 6,000-sq foot array of solar panels in Bangalore, India, which the company claims can run 50 kilowatts of computer equipment for around 330 days a year, running five hours a day. More
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ARM opens Taiwan R&D center in HsinchuBy Peter Clarke, EE Times, November 21, 2011The focus of the design center will be on physical IP development and processor implementation support for Cortex processors and Mali graphics processors. The center is working on 28-nm and 20-nm technologies for Cortex A-series processors, ARM said. More
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Solyndra: Its technology and why it failedDon Scansen, IP Research Group, November 21, 2011Marketing for Solyndra's unique tubular solar panel module design was at the top of the class, but was there more to this technology than just good PR? More
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Cypress-backed packaging firm launchesBy Dylan McGrath, EE Times, November 10, 2011Deca Technologies, a startup backed by Cypress Semiconductor and SunPower, came out of stealth mode this week to describe its initial focus on providing wafer-level chip scaling packaging services to semiconductor companies through a process that company representatives say is dramatically faster and substantially less costly than what is currently available on the market. More
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Cypress-backed packaging firm launchesBy Dylan McGrath, EE Times, November 9, 2011Deca Technologies, a startup backed by Cypress Semiconductor and SunPower, came out of stealth mode to describe its initial focus on providing wafer-level chip scaling packaging services to semiconductor companies through a process that company representatives say is dramatically faster and substantially less costly than what is currently available on the market. More
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Global chip sales show September growthBy Peter Clarke, EE Times, October 31, 2011The Japanese recovery and continued demand for mobile personal electronics helped the three-month average of worldwide sales of semiconductors in September reach $25.76 billion, according to the Semiconductor Industry Association, quoting figures compiled by the World Semiconductor Trade Statistics organization. More
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Harvesting boost charger features efficiency, low quiescent current, and superior cold-start capabilityBill Schweber, EETimes, October 28, 2011The bq25504 from Texas Instruments is a boost charger which manages the extraction of microwatts and milliwatts from solar, thermal, electromagnetic (RF), and vibration transducers as sources, and the storage of the energy in batteries and supercapacitors. More
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Use reinforced isolation for effective data couplersMark Cantrell, Analog Devices Inc, October 20, 2011Understand the requirements and mandates for electric-shock safety with respect to this common component. More
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IEF: TSMC pushes innovation for recoveryBy Peter Clarke, EE Times, October 6, 2011Taiwan Semiconductor Manufacturing Co Ltd is now expecting just 1% growth in the global semiconductor market in 2011, according to Maria Marced, president of TSMC Europe speaking at the International Electronics Forum. More
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Samsung fires up world's biggest memory fabBy Dylan McGrath, EE Times, September 22, 2011South Korea's Samsung Electronics has commenced production at its new Line-16 NAND flash memory chip fab at the company's Nano City Complex in South Korea's Gyeonggi province. More
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