• Plastic memory firm signs partners for printed systems

  Peter Clarke, EE Times, January 24, 2012
  Thin Film Electronics has joined forces with a number of partners to develop a low-cost printed electronic sensor platform that could be used to monitor the temperature of perishable goods such as food and pharmaceuticals.  More

• Soitec, Sumitomo offer 'smart-cut' GaN wafers

  Peter Clarke, EE Times, January 24, 2012
  Semiconductor manufacturing materials vendors Soitec and Sumitomo Electric Industries have announced that they have demonstrated four- and six-inch diameter engineered gallium nitride (GaN) wafer substrates and the launch of pilot production to enable wider market adoption.  More

• Teardown: The power inverter - from sunlight to power grid

  Steve Taranovich, Contributing Editor, January 13, 2012
  This teardown of a solar inverter card traces the path of harvested DC power from the photovoltaic panel, through boost conversion, power inverter and massive filtering of the created AC power signal required by the power grid. Surrounded by monitoring and microcontroller magic along with safety standard adherence, we uncover the mysteries of solar energy harvesting electronics.  More

• Imec is collaborating with Flamac on novel PV materials

  Nicolas Mokhoff, EE Times, December 21, 2011
    More

• IBM, Micron to build hybrid memory with TSVs

  EE Times staff, December 1, 2011
  Micron Technology Inc's hybrid memory cube (HMC) will become the first commercial CMOS manufacturing technology to employee IBM Corp's through-silicon via (TSV) process.  More

• IBM tries running datacenters on solar power

  By Sylvie Barak, EE Times, November 22, 2011
  IBM is harnessing the power of the sun with a massive installation of a 6,000-sq foot array of solar panels in Bangalore, India, which the company claims can run 50 kilowatts of computer equipment for around 330 days a year, running five hours a day.  More

• ARM opens Taiwan R&D center in Hsinchu

  By Peter Clarke, EE Times, November 21, 2011
  The focus of the design center will be on physical IP development and processor implementation support for Cortex processors and Mali graphics processors. The center is working on 28-nm and 20-nm technologies for Cortex A-series processors, ARM said.  More

• Solyndra: Its technology and why it failed

  Don Scansen, IP Research Group, November 21, 2011
  Marketing for Solyndra's unique tubular solar panel module design was at the top of the class, but was there more to this technology than just good PR?  More

• Cypress-backed packaging firm launches

  By Dylan McGrath, EE Times, November 10, 2011
  Deca Technologies, a startup backed by Cypress Semiconductor and SunPower, came out of stealth mode this week to describe its initial focus on providing wafer-level chip scaling packaging services to semiconductor companies through a process that company representatives say is dramatically faster and substantially less costly than what is currently available on the market.  More

• Cypress-backed packaging firm launches

  By Dylan McGrath, EE Times, November 9, 2011
  Deca Technologies, a startup backed by Cypress Semiconductor and SunPower, came out of stealth mode to describe its initial focus on providing wafer-level chip scaling packaging services to semiconductor companies through a process that company representatives say is dramatically faster and substantially less costly than what is currently available on the market.  More

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