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Components/New Products

New product information as well as design tips about passive devices and other components such as LEDs, LCDs, switches, sensors, cables, connectors, and motors.
Top Story
Top Story

Tiny lens harnesses oscillating water droplets 10/16/2008

From cell phones to military drones, many applications demand small, light optical lenses but can’t spare much power for focusing them. Researchers at Rensselaer Polytechnic Institute claim to have developed an innovative liquid lens that fits the bill.

News

Slimmer light guide heralds ultrathin-LCD panels 10/16/2008

Philips Research recently displayed a prototype of a 32-in. LCD television that measures only 8 mm thick—about 20% as thick as the slimmest commercially available panels. The key to the skinny design is a 1-mm-thick light-guide plate that uses patented technologies to uniformly distribute light from high-power, energy-efficient LED backlights.

Elpida, Qimonda may set up joint manufacturing activities 8/8/2008

Following Elpida Memory Inc’s announcement this week that it plans to set up a 300-mm wafer fab in China with a venture investment group that leverages technology created jointly with Qimonda AG, the Munich, Germany-based memory company is confirming that the two are continuing to discuss manufacturing partnership options. iSuppli Corp, which ranks Elpida and Qimonda as third and fifth largest DRAM makers, is predicting more turbulent times ahead for DRAM.

Miniature photocoupler features high-speed isolated switching 8/7/2008

Toshiba Electronics Europe has launched the TLP117 miniature photocoupler for applications requiring a combination of isolation, high-speed data transfer, and low-power operation.

Avnet inks HB-LED-focused distribution agreement 8/7/2008

Avnet Electronics Marketing and the Avnet LightSpeed team will work with customers on the application of Nuventix’s HB-LED-focused technology by offering specialized engineering and system-level design assistance

Infineon, STATS ChipPAC, STMicroelectronics to develop wafer-level-packaging standard 8/7/2008

Targeting the manufacture of future-generation semiconductor packages, STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG said today that they have agreed to jointly develop the next-generation of embedded wafer-level ball grid array technology, based on Infineon’s first-generation technology.
In-Depth

Compact fluorescent lights: Not always the best solution 10/30/2008

Prying Eyes: A look inside a CFL bulb helps explain why they're no good in downward-facing installations.

Optimize memory-system design for multimedia applications 9/4/2008

The convergence of video and communications in inexpensive unified-memory architectures has made DRAM the most important and the highest-performance target in any system.

The case of the stolen capacitor 9/4/2008

Tales From The Cube: An engineering change order erases a design's input stabilizing capacitance, with costly results.

ESR calculations for electrolytic capacitors at lower temperatures 8/20/2008

Use this empirically derived formula—and online calculator—to determine ESR at the low end of the temperature range.

Determining end-of-life, ESR, and lifetime calculations for electrolytic capacitors at higher temperatures 8/20/2008

Employing the Arrhenius equation.
Experts

All about surface-mount ferrites 8/21/2008

You may be surprised to learn that the performance of a ferrite bead in any power-filtering application can vary by more than a factor of 10, depending on the magnitude of dc current passing through the part during actual operation.

Voices: Harley Feldberg: the pulse of the industry 3/20/2008

Voices: EDN speaks with Avnet's Harley Feldberg about the economic situation, the growing role of Avnet in the design community, and the changing role of Asia in the industry.

Voices: Chano Gómez on powerline networking's "universal" hope 12/14/2007

How does UPA (Universal Powerline Association) technology cope with powerline noise? Why is it marketed as "200 Mbps" when it provides only a fraction of that? And is there hope for a true powerline standard? DS2's Chano Gomez provides technical and strategic insights.

Reach out and touch: Designing with touchscreens 9/27/2007

Although the touchscreen interface may be digital, the human interface is purely analog.

Roll back the lead-free initiative: 12 ROHS myths 9/13/2007

I'm all for environmental legislation when it actually helps. When it doesn't help, and it harms something else, I question the result.
DesignIdeas

Linear wind-power meter compensates for temperature 11/13/2008

Using a free-spinning anemometer for wind speed and a diode-connected transistor for temperature sensing, this meter measures the wind power available for "green" power generation.

Circuits drive single-coil latching relays 11/13/2008

Five driver circuits operate single-coil latching relays.

Precision capacitive-sensor interface suits miniature instruments 7/24/2008

A pair of one-shots develops a voltage proportional to the value of a capacitive sensor and transmits these readings via a LVDS interface.

Precision temperature controller has thermal-gradient compensation 6/12/2008

An electronic work-around cancels the effects of thermal gradients in the load's thermal impedances.

Capacitive touch switch uses CPLD 5/29/2008

Using an Altera MAX IIZ CPLD, you can implement a touch-switch decoder with no external components.
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