News Center

PIC32 expands connectivity support 11/18/2009

Microchip Technology’s PIC32MX5/6/7-family chips expand the connectivity support of PIC32 processors to cover 10/100-Mbps Ethernet; CAN (controller-area-network) 2.0b; and USB (Universal Serial Bus) host, device, and OTG (On-The-Go) peripherals.

Semiconductor revenue to rebound in 2010 after smaller-than-expected 2009 decline 11/16/2009

According to Gartner, revenue is on pace to total $226 billion in 2009, compared to 2008 revenue of $255 billion. Revenue is expected to bounce back in 2010 with a 13% increase.

Mentor joins SOI Industry Consortium 11/13/2009

In joining the group, the company aims to expand EDA tool and methodology support for SOI (silicon-on-insulator) technology.

Team hardens SiGe circuits 11/12/2009

Manufacturers once aimed certain process technologies at radiation-hardened designs. CMOS, for example, started out that way, when RCA (www.rca.com) developed its silicon-on-sapphire process. However, the overwhelming success of bulk-silicon CMOS processes has driven most of the alternatives into niches, forcing up their cost to the point that only the best-funded programs can use an alternativ...

Digital photomultipliers challenge vacuum-tube photomultipliers 11/12/2009

Despite massive improvements in solid-state light sensors in recent years, the detection of extremely low light levels has remained stubbornly resistant to the incursion of solid-state devices. The problems have been how to deal with the excessive dark count once you integrate the photodiodes into a circuit and how to reduce the cost of the specialized processes that the diodes require.

Voices: Leveling the playing field for small hardware start-ups 10/22/2009

Chumby designer Andrew Huang is among the first of a new breed of small-hardware-system entrepreneurs using China's electronics supply chain.

Voices: Asset InterTech Inc’s Tim Dehne: seeking growth in embedded instrumentation 8/20/2009

Tim Dehne, until recently a longtime executive with National Instruments Inc, has joined the board of directors of Asset InterTech Inc, a supplier of boundary-scan and embedded-instrumentation tools. Over a career stretching more than 21 years at NI, Dehne led global marketing and R&D at the company, which reported $824 million in revenues in 2008.

Voices: NXP’s René Penning de Vries: Moving beyond Moore 7/23/2009

René Penning de Vries, senior vice president and chief technology officer of NXP, spoke to EDN about how design and R&D is changing as we evolve passed the traditional definitions of Moore’s Law and into a new era based on value-added applications and guided more than ever before by economics.

Voices: Avnet’s Jeff Ittel: Think board to go broad 6/25/2009

Avnet's Jeff Ittel discusses designing across the board and its benefits to distributors and engineers.

Transformational change: the revolution to come in electronics design 6/16/2009

GUEST OPINION: Like the proverbial comet-strike that wiped out the dinosaurs, the global recession has changed the climate for electronics. You’d better think about changing your organization’s design culture—and maybe your corporate culture—to adapt.

Roles shift as the embedded-systems design chain disaggregates 11/13/2007

Roundtable discussion: What used to be a fairly linear design chain has morphed into a nebulous ecosystem, with shifting responsibilities and new complexities. EDN recently brought together a who's who of executives from this new world to discuss the situation.

Where do engineers get the best education? 11/6/2007

Breakfast in the Valley: While some countries push more knowledge on students, a panel of internationally educated executives say there is more to creating great engineers than just facts.

Airing problems in wireless 10/9/2007

Breakfast in the Valley:  Rapidly evolving technologies raise questions about data collisions between and within devices; future devices to become aware of what else is on the network.

The race for seamless connectivity
9/7/2007

Breakfast in the Valley: Vendors and carriers look to the unlicensed mobile access spectrum to bridge the gap between home, mobile and office voice and data communications around the globe; change is underway.

EDA, ESL in automotive: How do we get there? 8/24/2007

Breakfast in the Valley: When the automotive industry sees 22 million to 24 million cars and trucks recalled each year, but only sees 17 million cars and trucks sold every year, there’s a clear problem. And this problem is driving the automotive industry to turn to the electronic design engineering community for possible solutions for skyrocketing verification costs. A panel of experts discusses the options.

Cadence's beat 12/18/2007

Electronic News/EDN recently sat down with Mike Fister, president and CEO of Cadence Design Systems Inc. and the former senior VP and general manager of Intel Corp.'s enterprise platforms group, to discuss the EDA industry, work across the capital-equipment value chain, and life after Intel. 

Targeting Japan 11/6/2007

William Mitchell, chairman, president and CEO of Arrow Electronics, discusses the global distribution supply chain giant’s first Japanese subsidiary, how Japan differs from other parts of Asia, and the company’s strategy for the region in this one-on-one interview.

Distribution’s balancing act 10/30/2007

Executive Insight: Harley Feldberg, president of Avnet Electronics Marketing, discusses the Avnet Inc. operating group’s recent quarterly numbers, the distribution industry’s overall competitive landscape, and the global balancing act that the company uses to gain sales and market share in a challenging business environment in this one-on-one interview.

Inside Intel: Where next? 10/23/2007

In this second of two parts, Dadi Perlmutter, senior vice president and general manager of Intel’s Mobility Group, sounds off on the company’s plans to expand the Intel Architecture into new markets and the developments that will play a key role in making that happen.

Special Report: Inside Intel 10/16/2007

First of two parts: The world's biggest processor maker takes aim at data centers and consumer electronics with its new low-power chips and on-board graphics. Pat Gelsinger, senior vice president and general manager of Intel's Digital Enterprise Group, sat down with Electronic News to talk about the company's new target markets, integrated graphics and the next big thing.