Design Center

IC Design

Comprehensive coverage of the challenges IC designers face, the most significant technologies produced by providers of EDA (electronic design automation) tools and IP (intellectual property) cores, and the design methodologies other IC designers are using to become successful.
Top Story
Top Story

Handcrafted analog gets automated assist 9/4/2008

EDA tools address simulation, verification, and layout for mixed-signal designs.

News

Accellera approves analog, mixed-signal standard 8/20/2008

To allow the development of standard and tightly integrated Verilog-AMS modules and allow EDA software tool developers to implement EDA tools without ambiguities in the language interpretation, EDA standards organization Accellera announced today that it has approved a new version of its Verilog-analog mixed-signal (AMS) standard, Verilog-AMS 2.3, as an Accellera standard for analog and mixed-signal design and simulation.

Altera, Mentor team up to support avionics, military apps 8/19/2008

In support of the growing number of avionics and military applications requiring DO-254-certifiable components, San Jose-based programmable logic device company Altera Corp and Wilsonville, Ore-based IC design tool supplier Mentor Graphics Corp reported today that they are doing joint work to develop tools and methodologies for use in creating DO-254-certifiable IP that targets Altera’s FPGA and HardCopy ASICs.

Structured-ASIC option reaches 45-nm node 8/4/2008

Structured-ASIC pioneer eASIC announced today a family of fast-turn ASIC products at 45 nm, combining the zero-NRE (non-recurring expenses) and six-week turnaround of their via-programmed architecture with the performance, density, and power characteristics of the industry's most advanced production node.

Intel details PC graphics-aimed 'Larrabee' 8/4/2008

Santa Clara, Calif-based chip giant Intel Corp will present a paper at the Siggraph 2008 conference being held next week in Los Angeles that details features and capabilities for its forthcoming multi-core “Larrabee” architecture which includes a new approach to the software rendering 3-D pipeline, a many-core programming model and performance analysis for several applications.

Intel marches once again into microcontroller market 7/23/2008

Combining a single processor-core complex, North- and South-bridge functions, application-specific peripheral blocks, and in some cases an application accelerator, the chips in the family will create an x86-instruction-set alternative to the rainbow of ARM- and MIPS-based SOCs, at least for systems that can tolerate the considerable power and memory footprint involved.
In-Depth

Electronic-system-level design: Is there fire beneath the smoke? 8/21/2008

After years of overclaiming and underperforming, ESL design has a role in many design flows. But has anyone noticed?

On-chip test capabilities solve the analog-test problem for high-speed serial interfaces 8/21/2008

Including analog-test hardware in an SOC provides visibility into the performance of on-chip serial links, helping to ensure signal integrity and reduce the cost of manufacturing test.

Virtualization and multicore x86 CPUs 8/6/2008

The aggressive multicore roadmaps of the x86 chip vendors point to virtualization becoming ubiquitous in the near future. I/O support is the last remaining performance bottleneck for heavily virtualized data-center systems. Fortunately, a number of proven techniques under active development and standardization hope to keep stride with the increasing number of available CPU cores.

HDL-design challenges and philosophies for real-world ASIC implementations 7/24/2008

Prototyping with FPGAs works best if you do it with the final ASIC in mind.

RF: Will it ever be plug-in IP? 6/12/2008

As SOCs for mobile devices integrate radio circuits, they will need to reuse RF IP. But will they be able to?
Experts

IP selection and power supplies 8/21/2008

The failure to fully embrace just one of the two competing power-analysis standards has caused confusion and uncertainty among IP users about power-strategy compatibility.

ESL: The state of the industry and what’s next? 8/19/2008

GUEST OPINION: While ESL continues to remain in its infancy, there are signs in the industry that point towards eventual mainstream usage, however the scope of what is needed has to be more inclusive of the entire system-level design and verification flow.

Where is EDA going now? 7/10/2008

Some important changes have been altering the EDA landscape for years, and these changes—in the geographic composition of the chip-design community and in the nature of the chip-design process—are now impossible to conceal.

Your chip in half the time? 7/9/2008

GUEST OPINION: A project's commercial success depends on designers' ability to deliver silicon on time. That's why the industry recognizes the growing importance of time to results.

Third-party-IP providers: Physical-design questions, part two 6/26/2008

Engineers often overlook one physical-design issue for qualifying IP (intellectual-property) blocks: handling routing blockages and overlayer-routing conditions.
DesignIdeas

Save valuable picoseconds using ECL-wired OR 5/15/2008

Substituting wire-OR connections for an XOR/XNOR ECL gate allows the circuit to meet stringent timing contraints.

CPLD connects two instruments with half-duty-cycle generator 10/11/2007

A clocking circuit programmed into a CPLD generates a synchronizing pulse for a slower instrument at half the duty cycle of a faster instrument.

VHDL program enables PCI-bus-arbiter core 9/13/2007

A simple VHDL program enables microprocessors or DSPs to act as PCI-bus masters.

Use SystemVerilog for coverage metrics 3/29/2007

SystemVerilog constructs suit RTL design, high-level modeling, testbench creation, and assertion specification.
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Events

Defect-Based Testing Course

Dates: 9/16/2008 - 9/17/2008
Location: Munich, Germany

ARM Developers' Conference 2008

Dates: 10/7/2008 - 10/9/2008
Location: Santa Clara, CA

13th Si2/OpenAccess Conference

Dates: 10/13/2008 - 10/13/2008
Location: Santa Clara, CA

Wafer Fab Processing

Dates: 10/27/2008 - 10/30/2008
Location: San Jose, CA

Interconnect Process Integration

Dates: 10/31/2008 - 10/31/2008
Location: San Jose, CA

Blog

Practical Chip Design

Ken Tallo takes the reigns at OSCI, looks to the future

Intel's Ken Tallo has taken up the chairman's baton at the Open SystemC Initiative, the organization that drives adoption, infrastructure, and supp... 

Heard at Hot Chips: the hype grows around photovoltaic power generation

In an uncharacteristically non-integrated-circuit keynote topic, the Hot Chips conference this week offered up Dick Swanson, co-founder, president ... 

Heard at Hot Interconnects: another approach to networks on multicore chips

The Hot Interconnects session yesterday that explored photonic alternatives to interconnect for many-core processors and SoCs also produced a paper... 




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