News
Elpida, Qimonda may set up joint manufacturing activities 8/8/2008
Following Elpida Memory Inc’s announcement this week that it plans to set up a 300-mm wafer fab in China with a venture investment group that leverages technology created jointly with Qimonda AG, the Munich, Germany-based memory company is confirming that the two are continuing to discuss manufacturing partnership options. iSuppli Corp, which ranks Elpida and Qimonda as third and fifth largest DRAM makers, is predicting more turbulent times ahead for DRAM.Miniature photocoupler features high-speed isolated switching 8/7/2008
Toshiba Electronics Europe has launched the TLP117 miniature photocoupler for applications requiring a combination of isolation, high-speed data transfer, and low-power operation.Avnet inks HB-LED-focused distribution agreement 8/7/2008
Avnet Electronics Marketing and the Avnet LightSpeed team will work with customers on the application of Nuventix’s HB-LED-focused technology by offering specialized engineering and system-level design assistanceInfineon, STATS ChipPAC, STMicroelectronics to develop wafer-level-packaging standard 8/7/2008
Targeting the manufacture of future-generation semiconductor packages, STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG said today that they have agreed to jointly develop the next-generation of embedded wafer-level ball grid array technology, based on Infineon’s first-generation technology.LP DDR2 DRAM momentum begins to build 7/25/2008
The LP DDR2 specification is potentially important to mobile device designers, and also to developers of power-conscious servers, primarily because of its reduced operating voltages. However, the devil is in the implementation details.In-Depth
Optimize memory-system design for multimedia applications 9/4/2008
The convergence of video and communications in inexpensive unified-memory architectures has made DRAM the most important and the highest-performance target in any system.ESR calculations for electrolytic capacitors at lower temperatures 8/20/2008
Use this empirically derived formula—and online calculator—to determine ESR at the low end of the temperature range.Determining end-of-life, ESR, and lifetime calculations for electrolytic capacitors at higher temperatures 8/20/2008
Employing the Arrhenius equation.Revisiting electronic ink 8/7/2008
Prying Eyes: Electronic ink has changed in the seven years since we last took a look at it.Estimating junction temperature from top-surface temperature in power MOSFETs 5/30/2008
If you can determine the surface temperature of a MOSFET package with a bench probe, you can get a good idea of the device's junction temperature.Experts
All about surface-mount ferrites 8/21/2008
You may be surprised to learn that the performance of a ferrite bead in any power-filtering application can vary by more than a factor of 10, depending on the magnitude of dc current passing through the part during actual operation.Voices: Harley Feldberg: the pulse of the industry 3/20/2008
Voices: EDN speaks with Avnet's Harley Feldberg about the economic situation, the growing role of Avnet in the design community, and the changing role of Asia in the industry.Voices: Chano Gómez on powerline networking's "universal" hope 12/14/2007
How does UPA (Universal Powerline Association) technology cope with powerline noise? Why is it marketed as "200 Mbps" when it provides only a fraction of that? And is there hope for a true powerline standard? DS2's Chano Gomez provides technical and strategic insights.Reach out and touch: Designing with touchscreens 9/27/2007
Although the touchscreen interface may be digital, the human interface is purely analog.Roll back the lead-free initiative: 12 ROHS myths 9/13/2007
I'm all for environmental legislation when it actually helps. When it doesn't help, and it harms something else, I question the result.DesignIdeas
