ESC Con 2015

Components & Packaging

Rich Pell
Editor
A resource and community for engineers involved in the design, selection and application of electronic components and hardware, including resistors, capacitors, inductors, transistors, diodes connectors, switches, relays, cabling, IC and system packaging, enclosures, circuit protection devices and thermal management. The Center includes in-depth technical design articles, blogs, regulatory and industry updates, technical papers, webinars, product updates and reviews, design ideas, forums, commentary and Q&A.

Linear Technology knows how to make a Power uModule

There is an art to designing a power supply that is fully enclosed in a compact molded plastic package. Read More...

New demands on DC-link power capacitors

Due to the continuous development of power electronics following the trends of miniaturisation, increase of reliability, and improve-ment of efficiency, concrete demands on electronic components are claimed. Since new technologies and materials for semiconductors were successful introduced in the market in the last years, an improvement of passive components is mandatory as well. This paper introduces a new robust capacitor technology overcoming limits in the high temperature range and power density. Unique device features and characteristics will be explained enabling new ideas in power electronic designs. Furthermore, low inductive design solutions are discussed and an outlook for further developments is given. Read More...

LEDs battle ebola and climate change while boosting the economy

This week's Semi-Coherent Emissions top story: The LED lighting industry's performance provides compelling evidence that strong economic growth and high environmental quality aren't mutually-exclusive. Read More...

Validating MEMS and other sensors

Sensor validation requires a thorough blend of environmental, mechanical, and electrical techniques. Read More...

How soft errors damage vital information

Here is how soft errors occur and how they can cause damage to critical data stored in semiconductor memories. The article covers the sources and the likelihood of their occurrence and explains how they impact individual memory cells, causing them to change state Read More...

Aluminum capacitor slideshow: Handling heat issues

The following presentation is an excellent technical tutorial given by Vishay Product Marketing engineer, Theo van de Steeg on handling heat issues when working especially with aluminum capacitors. Read More...

Zener-enhanced Dark Emitting Diodes (ZeDEDs) deliver 10X more Dark per Watt

YoYo Dyne Systems' new family of Zener-enhanced dark-emitting diodes (ZeDEDs) features a novel junction structure and an integrated light sink to achieve a 10X boost in performance over equivalent-sized conventional darkness emitters. Read More...

Select circuit-protection devices with free online tool

The ESD Suppression Selection Tool from Littelfuse lets circuit designers do a “dry run” on a device’s ESD performance without building a test board. Read More...

Xpedition Package Integrator spans IC chip to package to PCB

Mentor's new Package Integrator allows co-design of chips, single- & multi-chip packaging, and PCB layout. Read More...

Zipper fins improve heat-sink performance

Lightweight zipper-fin heat sinks from Advanced Thermal Solutions offer fin profiles with high aspect ratios, enabling taller, thinner, and more tightly packed fins for greater cooling performance. Read More...

Fine-pitch connectors fit smart phones, IoT devices

TE Connectivity has expanded its line of board-to-board connectors with three devices, including a 0.4-mm fine-pitch EMI-shielded board-to-FPC (flexible printed circuit) connector, a 0.4-mm pitch board-to-board connector, and a 0.35-mm pitch board-to-board connector with a locking peg design. Read More...

Avago Tech Note: Smart gate-drive optocoupler with integrated flyback controller

A smart gate-drive optocoupler for FETs & IGBTs is ideal for distributed power supplies, power inverters, motor drives, and more. Read More...

Self-driving cars? Puhleeeze…

I love the idea of self-driving cars, but how can we trust the automakers to engineer them well enough? Read More...

Product how-to: Build your own designs on flexible circuit boards

Flexible PCBs are becoming low-cost and accessible even to hobbyists. Read More...

Avago Tech Note: Optocouplers in intrinsic safety applications

Intrinsic safety applications defined in IEC 60079-11 require careful selection of isolation components. Read More...

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Avago Tech Note: Smart gate-drive optocoupler with integrated flyback controller

A smart gate-drive optocoupler for FETs & IGBTs is ideal for distributed power supplies, power inverters, motor drives, and more. Read More...

Avago Tech Note: Optocouplers in intrinsic safety applications

Intrinsic safety applications defined in IEC 60079-11 require careful selection of isolation components. Read More...

Avago Tech Note: 5MBd Digital optocouplers targeting low power/low supply voltage applications

Digital optocouplers provide high voltage insulation and noise rejection for data transmission, with very low power usage. Read More...

Design Notes: Matched Resistor Networks for Precision Amplifier Applications

The actual performance of precision amplifiers and ADCs is often difficult to achieve since data sheet specifications assume ideal components. Carefully matched resistor networks can enable precision matching orders of magnitude better than discrete components, ensuring data sheet specifications are met for precision ICs. Read More...

Circuit's RMS output is linearly proportional to temperature over wide range

In this design idea the concept of the p-n diode driven at constant current is extrapolated, potentially eliminating voltage references and op amps. The result is a unique implementation of a simple but highly accurate temperature proportional circuit. Read More...

Photo meter assesses ambient light

When most PN-junction diodes are reverse biased, they will produce a small photovoltaic output as the light level is increased. Read More...

Quasistatic Spice model targets ceramic capacitors with Y5V dielectric

Run more accurate Spice simulations by accounting for the capacitance variation versus applied voltage. Read More...

Complementary-pair dc/dc converter simultaneously doubles, inverts supply voltage

Change a single positive supply into twice its positive and equal negative voltages. Read More...

Obtain a gain of 450 from one vacuum tube

Combine sand (silicon) with vacuum tube technology to get the best of both. Read More...

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Controllers monitor critical thermoelectric equipment

Bidirectional programmable temperature controllers in the SR-54 series from Laird can be incorporated into a thermoelectric assembly (TEA) to add integrated temperature control with built-in monitoring and control intelligence. Read More...

LED light guides deliver affordable OLED-like performance

Sleek, stylish and seductively luminous, OLED panels' silky, eerily-even glow has made them a favorite for fashion-forward lighting designers, even though they cost more, were shorter lived, and more easily damaged. This may change however, as Global Lighting Technologies' (GLT) introduces a growing number of products based on its edge-lit LED-based light guide technology. Read More...

LEDs battle ebola and climate change while boosting the economy

This week's Semi-Coherent Emissions top story: The LED lighting industry's performance provides compelling evidence that strong economic growth and high environmental quality aren't mutually-exclusive. Read More...

Zener-enhanced Dark Emitting Diodes (ZeDEDs) deliver 10X more Dark per Watt

YoYo Dyne Systems' new family of Zener-enhanced dark-emitting diodes (ZeDEDs) features a novel junction structure and an integrated light sink to achieve a 10X boost in performance over equivalent-sized conventional darkness emitters. Read More...

Select circuit-protection devices with free online tool

The ESD Suppression Selection Tool from Littelfuse lets circuit designers do a “dry run” on a device’s ESD performance without building a test board. Read More...

Xpedition Package Integrator spans IC chip to package to PCB

Mentor's new Package Integrator allows co-design of chips, single- & multi-chip packaging, and PCB layout. Read More...

Zipper fins improve heat-sink performance

Lightweight zipper-fin heat sinks from Advanced Thermal Solutions offer fin profiles with high aspect ratios, enabling taller, thinner, and more tightly packed fins for greater cooling performance. Read More...

GaN transistor boosts efficiency, power density

Transphorm is offering engineering samples of the TPH3205WS, a 600-V GaN transistor in a small 3-pin TO-247 package that delivers high-efficiency operation in 80 Plus Titanium-class power-supply and inverter applications up to 3 kW. Read More...

Fine-pitch connectors fit smart phones, IoT devices

TE Connectivity has expanded its line of board-to-board connectors with three devices, including a 0.4-mm fine-pitch EMI-shielded board-to-FPC (flexible printed circuit) connector, a 0.4-mm pitch board-to-board connector, and a 0.35-mm pitch board-to-board connector with a locking peg design. Read More...

PCB design tool links Altium & SolidWorks

PCBWorks is a PCB design tool created by Altium to enhance workflow collaboration between electrical and mechanical designers. Read More...

Wearable sensor measures UV index

The latest addition to STMicroelectronics’ portfolio of environmental sensors, the UVIS25 provides a direct digital output of UVI (ultraviolet index)—the international measurement of the strength of ultraviolet radiation, primarily from the sun, at a given place and time. Read More...

Desktop milling machine creates PCBs and packaging

Version 2 of the Othermill will create your PCB, enclosure, and other parts – on your benchtop. Read More...

SIM connector fits wearable electronics

GradConn’s CH03-KA is the company’s smallest SIM card connector, coming in at just 12.3x10.0 mm with a profile of 1.55 mm for use in handheld devices and wearable electronics. Read More...

Chip-scale bi-directional MOSFET for lithium battery protection

The DMN2023UCB4 bi-directional MOSFET provides enhanced protection for charging 1- and 2-cell lithium batteries. Read More...

See the details with an HD thermal imager

Fluke's TiX1000 series of high-definition thermal imaging cameras let you see temperature on circuit components, wires, even whole cities. Read More...

Tact switch combines resilience, excellent operating feel

In response to the strict robustness and resilience requirements in the automotive industry, component manufacturer, ALPS Electric has developed and commenced mass production of the SKTH Series TACT Switch. Read More...

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Teardown: Lightning strike explodes a switch's IC

In this case, there is no doubt as to the reason for a GbE switch's demise after a quick teardown. Read More...

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Cable material design criteria for the medical industry

This paper examines the particular design and fabrication challenges of medical cables, including the design parameters, material choices and manufacturing requirements that medical device manufacturers need to know to ensure that medical device interconnection is precise, reliable and durable – and protect them from liability. Read More...

Designing a high-efficiency planar transformer for 250-W+ converter topologies

Planar transformers are being redesigned to fit higher-power (greater than 250-W) applications. Two advances have been developed and are discussed here. Read More...

The Circuit Designer's Companion: RF cables, twisted pair and crosstalk

Part 5 of an excerpt from the book "The Circuit Designer's Companion, 3rd Ed." looks at coaxial cables, twisted pairs, and the issue of crosstalk and how to combat it. Read More...

The Circuit Designer's Companion: The safety earth and wiring/cables

Part 4 of an excerpt from the book "The Circuit Designer's Companion, 3rd Ed." examines the safety earth and begins a look at the major types of wiring and cables. Read More...

The Circuit Designer's Companion: Inter-board interfacing, star grounding & shielding

Part 3 of an excerpt from the book "The Circuit Designer's Companion, 3rd Ed." covers inter-board interface signals, star grounding, and shielding. Read More...

The Circuit Designer's Companion: Power supply returns & I/O signal grounding

Part 2 of an excerpt from the book "The Circuit Designer's Companion, 3rd Ed." considers power supply returns and input/output signal grounding. Read More...

Piling functionality and its impact on packaging manufacturing and reliability

Packaging engineers must understand the dynamics of development, qualification, and HVM of FCBGA packages to keep pace with the ever-changing demands of industrial and automotive applications. Depending on the approach, the drive for higher performance can lead packaging engineers to either great rewards or great pains. Read More...

The Circuit Designer's Companion: Grounding and wiring

Part 1 of an excerpt from the book "The Circuit Designer's Companion, 3rd Ed." begins a look at grounding: when to consider it, how chassis materials affect it, and the problem of ground loops. Read More...

LVPECL terminations - A circuit approach

Looking at LVPECL terminations from a circuit perspective shows how the important factors, output transistor currents and minimizing component count and power, account for the LVPECL termination topologies and component values of common terminations. Read More...

Avionics lightning protection design GUI

To select the appropriate components for a lightning protection circuit, the transient experienced during the lightning test must be transformed into the transients used to rate the components, as shown in their datasheets. This paper introduces a free tool that performs these transformations. Read More...

ESD target levels: Impacting ESD from components to systems

The Industry Council on ESD Target Levels can help the industry progress by addressing the semiconductor electronics technology roadmap in parallel with the necessary but realistic ESD roadmap. Read More...

Resistor datasheets: Reading between the lines

Many component datasheets should come with a warning label to the effect that terms such as "tolerance" and "TCR" are being used loosely. Read More...

Connect passive components to logic gates

By adding a few passive components to logic gates, you can make circuits such as level converters, frequency multipliers, phase detectors, line drivers, and pulse changers. Read More...

Resistors aren't resistors

At high frequencies, inductance and capacitance add reactance to what you think of as purely resistive components. Read More...

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Shatter bottlenecks in WLANs and keep legacy infrastructure

Here’s how installed cable can still achieve multi-gigabit data rates in the enterprise. Read More...

Air Force reveals its new aircraft cloaking system uses dark-emitting diodes (DEDs)

Star Trek has finally met its match in real life with the U. S. Air Force’s revelation of a new stealth technology based on dark-emitting diodes (DEDs). Read More...

Self-driving cars? Puhleeeze…

I love the idea of self-driving cars, but how can we trust the automakers to engineer them well enough? Read More...

Save face with component checklists

Keep egg off your face with these handy component selection checklists. Read More...

Designer's Notebook: Hot & cold running oscillators

Being a light overview of ways to generate accurate frequencies. Read More...

Beating the heat: Not without a heat sink

A robustly-featured product hampered by a manufacturing defect is unfortunate, but continuing to sell such a product without fixing the flaw is shameful. Read More...

Designer's Notebook: Signal Isolation

A quick overview of signal isolation techniques. Read More...

Vote for the Engineer of the Year

DesignCon2015 has announced the finalists for the Engineer of the Year Award (sponsored by National Instruments). The award includes a $10,000 grant that will be given out at DesignCon. Read More...

Obscure AC line connectors challenge designers, consumers

Basic plugs and connectors are standardized, but there are many specialized ones you'll run into that are a problem when they need to be replaced. Read More...

Turkish delights and harsh environments

A Turkish bath experience prompts thoughts on the harsh environment of space and how it can can wreak havoc on unprotected microelectronics, ultimately leading to component failure. Cosmic rays speeding through space can strike ICs at sensitive locations, causing immediate upsets known as SEEs. Read More...

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