ESC Con 2015

Components & Packaging

Rich Pell
Editor
A resource and community for engineers involved in the design, selection and application of electronic components and hardware, including resistors, capacitors, inductors, transistors, diodes connectors, switches, relays, cabling, IC and system packaging, enclosures, circuit protection devices and thermal management. The Center includes in-depth technical design articles, blogs, regulatory and industry updates, technical papers, webinars, product updates and reviews, design ideas, forums, commentary and Q&A.

Zipper fins improve heat-sink performance

Lightweight zipper-fin heat sinks from Advanced Thermal Solutions offer fin profiles with high aspect ratios, enabling taller, thinner, and more tightly packed fins for greater cooling performance. Read More...

Fine-pitch connectors fit smart phones, IoT devices

TE Connectivity has expanded its line of board-to-board connectors with three devices, including a 0.4-mm fine-pitch EMI-shielded board-to-FPC (flexible printed circuit) connector, a 0.4-mm pitch board-to-board connector, and a 0.35-mm pitch board-to-board connector with a locking peg design. Read More...

Avago Tech Note: Smart gate-drive optocoupler with integrated flyback controller

A smart gate-drive optocoupler for FETs & IGBTs is ideal for distributed power supplies, power inverters, motor drives, and more. Read More...

Self-driving cars? Puhleeeze…

I love the idea of self-driving cars, but how can we trust the automakers to engineer them well enough? Read More...

Product how-to: Build your own designs on flexible circuit boards

Flexible PCBs are becoming low-cost and accessible even to hobbyists. Read More...

Avago Tech Note: Optocouplers in intrinsic safety applications

Intrinsic safety applications defined in IEC 60079-11 require careful selection of isolation components. Read More...

Save face with component checklists

Keep egg off your face with these handy component selection checklists. Read More...

Checklists: Do or die

Do you use checklists as part of your design process? Read More...

Avago Tech Note: 5MBd Digital optocouplers targeting low power/low supply voltage applications

Digital optocouplers provide high voltage insulation and noise rejection for data transmission, with very low power usage. Read More...

Designer's Notebook: Hot & cold running oscillators

Being a light overview of ways to generate accurate frequencies. Read More...

Desktop milling machine creates PCBs and packaging

Version 2 of the Othermill will create your PCB, enclosure, and other parts – on your benchtop. Read More...

SIM connector fits wearable electronics

GradConn’s CH03-KA is the company’s smallest SIM card connector, coming in at just 12.3x10.0 mm with a profile of 1.55 mm for use in handheld devices and wearable electronics. Read More...

How to measure capacity versus bias voltage on MLCCs

High-capacity, multilayer ceramic capacitors (MLCC) have a property often not well understood by electronic designers: the capacitance of these devices varies with applied DC voltage. Read More...

Conquering the 'kink' in sub-threshold power MOSFET behavior: A simple compact modeling approach

This article explains the physical reasons behind the unusual electric behavior of power MOSFETs operating in sub-threshold and weak-inversion modes and presents a simple, low-overhead subcircuit-based compact modeling approach to conquer these "kinks" in dc characteristics with standard BSIM3 compact models. Read More...

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Avago Tech Note: Smart gate-drive optocoupler with integrated flyback controller

A smart gate-drive optocoupler for FETs & IGBTs is ideal for distributed power supplies, power inverters, motor drives, and more. Read More...

Avago Tech Note: Optocouplers in intrinsic safety applications

Intrinsic safety applications defined in IEC 60079-11 require careful selection of isolation components. Read More...

Avago Tech Note: 5MBd Digital optocouplers targeting low power/low supply voltage applications

Digital optocouplers provide high voltage insulation and noise rejection for data transmission, with very low power usage. Read More...

Design Notes: Matched Resistor Networks for Precision Amplifier Applications

The actual performance of precision amplifiers and ADCs is often difficult to achieve since data sheet specifications assume ideal components. Carefully matched resistor networks can enable precision matching orders of magnitude better than discrete components, ensuring data sheet specifications are met for precision ICs. Read More...

Circuit's RMS output is linearly proportional to temperature over wide range

In this design idea the concept of the p-n diode driven at constant current is extrapolated, potentially eliminating voltage references and op amps. The result is a unique implementation of a simple but highly accurate temperature proportional circuit. Read More...

Photo meter assesses ambient light

When most PN-junction diodes are reverse biased, they will produce a small photovoltaic output as the light level is increased. Read More...

Quasistatic Spice model targets ceramic capacitors with Y5V dielectric

Run more accurate Spice simulations by accounting for the capacitance variation versus applied voltage. Read More...

Complementary-pair dc/dc converter simultaneously doubles, inverts supply voltage

Change a single positive supply into twice its positive and equal negative voltages. Read More...

Obtain a gain of 450 from one vacuum tube

Combine sand (silicon) with vacuum tube technology to get the best of both. Read More...

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Zipper fins improve heat-sink performance

Lightweight zipper-fin heat sinks from Advanced Thermal Solutions offer fin profiles with high aspect ratios, enabling taller, thinner, and more tightly packed fins for greater cooling performance. Read More...

GaN transistor boosts efficiency, power density

Transphorm is offering engineering samples of the TPH3205WS, a 600-V GaN transistor in a small 3-pin TO-247 package that delivers high-efficiency operation in 80 Plus Titanium-class power-supply and inverter applications up to 3 kW. Read More...

Fine-pitch connectors fit smart phones, IoT devices

TE Connectivity has expanded its line of board-to-board connectors with three devices, including a 0.4-mm fine-pitch EMI-shielded board-to-FPC (flexible printed circuit) connector, a 0.4-mm pitch board-to-board connector, and a 0.35-mm pitch board-to-board connector with a locking peg design. Read More...

PCB design tool links Altium & SolidWorks

PCBWorks is a PCB design tool created by Altium to enhance workflow collaboration between electrical and mechanical designers. Read More...

Wearable sensor measures UV index

The latest addition to STMicroelectronics’ portfolio of environmental sensors, the UVIS25 provides a direct digital output of UVI (ultraviolet index)—the international measurement of the strength of ultraviolet radiation, primarily from the sun, at a given place and time. Read More...

Desktop milling machine creates PCBs and packaging

Version 2 of the Othermill will create your PCB, enclosure, and other parts – on your benchtop. Read More...

SIM connector fits wearable electronics

GradConn’s CH03-KA is the company’s smallest SIM card connector, coming in at just 12.3x10.0 mm with a profile of 1.55 mm for use in handheld devices and wearable electronics. Read More...

Chip-scale bi-directional MOSFET for lithium battery protection

The DMN2023UCB4 bi-directional MOSFET provides enhanced protection for charging 1- and 2-cell lithium batteries. Read More...

See the details with an HD thermal imager

Fluke's TiX1000 series of high-definition thermal imaging cameras let you see temperature on circuit components, wires, even whole cities. Read More...

Tact switch combines resilience, excellent operating feel

In response to the strict robustness and resilience requirements in the automotive industry, component manufacturer, ALPS Electric has developed and commenced mass production of the SKTH Series TACT Switch. Read More...

Software speeds simulation of electromagnetic properties

3-D EM Simulation Platform provides significant FEM Simulation Speed Increase. Read More...

Mentor meets Digi-Key, low-cost CAD results

Designer, DX Designer's little brother, is out of beta and available to purchase. Read More...

Thermal gels extend heat conductivity range

Parker Chomerics has uprated its thermal management solutions with the release of its THERM-A-GAP gel with conductivity extensions to 6 W/m-k. Read More...

EDN Hot 100 products of 2014: Components & Sensors

This section of EDN's Hot 100 Products of 2014 features components - including passive and active discretes, as well as electromechanical devices - and sensor products. Read More...

Littlefuse announces circuit-protection at Electronica

The company is also announcing LED circuit protection, reed-sensing devices, and thyristors. Read More...

Chip power inductors suit power circuits of portables

ALPS Green Devices has developed the "GLCLK Series" and "GLCLM Series" Liqualloy Power Inductors, suitable for power supply circuits of displays for smartphones and other compact mobile devices, such as tablets and digital cameras. Read More...

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Teardown: Lightning strike explodes a switch's IC

In this case, there is no doubt as to the reason for a GbE switch's demise after a quick teardown. Read More...

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Cable material design criteria for the medical industry

This paper examines the particular design and fabrication challenges of medical cables, including the design parameters, material choices and manufacturing requirements that medical device manufacturers need to know to ensure that medical device interconnection is precise, reliable and durable – and protect them from liability. Read More...

Designing a high-efficiency planar transformer for 250-W+ converter topologies

Planar transformers are being redesigned to fit higher-power (greater than 250-W) applications. Two advances have been developed and are discussed here. Read More...

The Circuit Designer's Companion: RF cables, twisted pair and crosstalk

Part 5 of an excerpt from the book "The Circuit Designer's Companion, 3rd Ed." looks at coaxial cables, twisted pairs, and the issue of crosstalk and how to combat it. Read More...

The Circuit Designer's Companion: The safety earth and wiring/cables

Part 4 of an excerpt from the book "The Circuit Designer's Companion, 3rd Ed." examines the safety earth and begins a look at the major types of wiring and cables. Read More...

The Circuit Designer's Companion: Inter-board interfacing, star grounding & shielding

Part 3 of an excerpt from the book "The Circuit Designer's Companion, 3rd Ed." covers inter-board interface signals, star grounding, and shielding. Read More...

The Circuit Designer's Companion: Power supply returns & I/O signal grounding

Part 2 of an excerpt from the book "The Circuit Designer's Companion, 3rd Ed." considers power supply returns and input/output signal grounding. Read More...

Piling functionality and its impact on packaging manufacturing and reliability

Packaging engineers must understand the dynamics of development, qualification, and HVM of FCBGA packages to keep pace with the ever-changing demands of industrial and automotive applications. Depending on the approach, the drive for higher performance can lead packaging engineers to either great rewards or great pains. Read More...

The Circuit Designer's Companion: Grounding and wiring

Part 1 of an excerpt from the book "The Circuit Designer's Companion, 3rd Ed." begins a look at grounding: when to consider it, how chassis materials affect it, and the problem of ground loops. Read More...

LVPECL terminations - A circuit approach

Looking at LVPECL terminations from a circuit perspective shows how the important factors, output transistor currents and minimizing component count and power, account for the LVPECL termination topologies and component values of common terminations. Read More...

Avionics lightning protection design GUI

To select the appropriate components for a lightning protection circuit, the transient experienced during the lightning test must be transformed into the transients used to rate the components, as shown in their datasheets. This paper introduces a free tool that performs these transformations. Read More...

ESD target levels: Impacting ESD from components to systems

The Industry Council on ESD Target Levels can help the industry progress by addressing the semiconductor electronics technology roadmap in parallel with the necessary but realistic ESD roadmap. Read More...

Resistor datasheets: Reading between the lines

Many component datasheets should come with a warning label to the effect that terms such as "tolerance" and "TCR" are being used loosely. Read More...

Connect passive components to logic gates

By adding a few passive components to logic gates, you can make circuits such as level converters, frequency multipliers, phase detectors, line drivers, and pulse changers. Read More...

Resistors aren't resistors

At high frequencies, inductance and capacitance add reactance to what you think of as purely resistive components. Read More...

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Self-driving cars? Puhleeeze…

I love the idea of self-driving cars, but how can we trust the automakers to engineer them well enough? Read More...

Save face with component checklists

Keep egg off your face with these handy component selection checklists. Read More...

Designer's Notebook: Hot & cold running oscillators

Being a light overview of ways to generate accurate frequencies. Read More...

Beating the heat: Not without a heat sink

A robustly-featured product hampered by a manufacturing defect is unfortunate, but continuing to sell such a product without fixing the flaw is shameful. Read More...

Designer's Notebook: Signal Isolation

A quick overview of signal isolation techniques. Read More...

Vote for the Engineer of the Year

DesignCon2015 has announced the finalists for the Engineer of the Year Award (sponsored by National Instruments). The award includes a $10,000 grant that will be given out at DesignCon. Read More...

Obscure AC line connectors challenge designers, consumers

Basic plugs and connectors are standardized, but there are many specialized ones you'll run into that are a problem when they need to be replaced. Read More...

Turkish delights and harsh environments

A Turkish bath experience prompts thoughts on the harsh environment of space and how it can can wreak havoc on unprotected microelectronics, ultimately leading to component failure. Cosmic rays speeding through space can strike ICs at sensitive locations, causing immediate upsets known as SEEs. Read More...

My long-running affection for heat sinks

As a bulk-metal component, the heat sink is the opposite of the million-gate, submicron-process IC or a power-handling discrete device; despite this obvious difference, it is often critical to the viability and long life of those more glamorous active components. Read More...

Using a differential probe to troubleshoot EMI

One other tool you may want to consider when troubleshooting and EMI issue is a high frequency differential probe. We’ll use the Rohde & Schwarz RT-ZD10 1 GHz bandwidth probe, but similar probes from other manufacturers should work equally well. Read More...

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