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Table 1NTHS-J14 thermistor profile |
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| Temperature (°C) | RT (kOhm) |
| -40 | 14.4 |
| -15 | 4.685 |
| 10 | 1.68 |
| 25 | 1 |
| 35 | 0.741 |
| 60 | 0.35 |
| 85 | 0.1855 |
Determining the appropriate size of filter capacitors in power-supply designs is often difficult. Most designers tend to overdo it and add unnecessary cost and size to the design. However, you can use a stepping feature in Microcap V (Spectrum Software, www.spectrumsoft.com) to ascertain the trade-offs and choose the best values for your design.
Figure 1 shows a simple 18V open-loop regulator circuit with an input circuit that you can use to test the regulator for input ripple rejection over a 10 Hz to 10 MHz bandwidth. You can ignore the input circuit because it only simulates a test fixture in the analysis.
The simulations aim to determine the smallest values of C1 and C2 that allow the circuit to achieve reasonable ripple rejection. Figure 2a shows the resultant rejection in the ratio of output ripple to input ripple over the stated frequency range, as C1 steps from 1 to 151 mF in 50-mF steps. Figure 2b shows the result when C2 steps from 1 to 16 mF in 5-mF steps. Changes in C1 don't produce radically different curves; changes in C2 produce more variations in the amount of ripple because of the well-known capacitance-multiplier effect of Q1. The impedance of Q1 represents a large resistance between the source and C1. This resistance allows a much smaller value of C1 to produce the same effect at a given frequency as a larger value.
Figure 2c shows the final result with C1 equal to 1 mF and C2 equal to 5 mF. When used together, these two minimum effective values result in acceptably low levels of ripple using half the capacitance for C2 and 1/100 the capacitance for C1. The advantage of these lower capacitance values outweighs the 14-dB difference in rejection between Figure 2c and the lowest curves in Figure 2b. Other applications may have other rejection requirements, and thus you must choose the capacitor accordingly. This technique makes it easy to determine the trade-offs and make the right choice. (DI #2240)
Most crystal oscillators suffer from three drawbacks: They can't drive much of a load, the duty cycle isn't adjustable, and the duty cycle drifts. The crystal oscillator in Figure 1 solves these problems. Three parallel gates drive heavy loads, the duty cycle is adjustable from 25 to 75%; and feedback minimizes the drift.
The oscillator circuit comprises C1, C2, C3, R1, R2, R3, one gate, and the crystal. R1 and R3 bias the gate in its linear region, and the capacitors form a p filter around the crystal. The p network preserves the crystal's Q factor, provides the correct loading capacitance for the crystal, and prevents oscillations at spur frequencies. R2 limits the crystal's power dissipation to 5 mW. The difference between the output voltage (3.9V) and the input voltage (2V) is about 1.9V, which is a typical TTL threshold voltage. Therefore, you can use the following equation to select R2, even though the equation is an optimistic approximation:
Thus, for PCRYSTAL=5 mW and R2=722 Ohm, you should select R2=750 Ohm.
R2 and C3 form a lowpass filter whose -3-dB point should be at FOSC/8 or higher. This choice prevents spurious high-frequency oscillations. The -3-dB point for this design equals FOSC/8=625 kHz. You can use the following equation to calculate C3:
![[equation]](images/die3.gif)
Because C1 must have a large value to minimize the effects of stray capacitance changes, 510 pF is an acceptable value. The series combination of C1, C2, and C3 must equal the specified load capacitance for a parallel resonant crystal, so that
![[equation]](images/die4.gif)
The load capacitance for the selected crystal is 32 pF, which requires a C2 of 38.5 pF or a real value of 39 pF. With the component values in Figure 1, the circuit oscillates at 5 MHz with a parallel resonant crystal. The duty cycle is a function of the gate bias-point resistors. Therefore, variations in logic gates cause variations in duty cycletypically, 30 to 65% with normal manufacturing tolerances. The duty-cycle adjustment compensates for this variation, and the feedback provided by the op amps reduces drifts to a fraction of 1%.
IC1A integrates the oscillator output into a dc level. The ICL7621A works well for this function because it has a high input impedance and a large output swing and because it operates with a 5V supply. IC2A sums the integrated signal with the duty-cycle setpoint voltage to create an error signal. The feedback loop keeps the duty cycle constant by changing the oscillator gate's bias point until the error signal reaches zero.
The circuit parallels the output gates for increased drive capability. All gates are in the same IC, so you can safely connect them in parallel, and the oscillator/output gate delays match well under reasonable loading conditions. When necessary, the input-enable signal gates the oscillator output with just a gate delay. Turning the oscillator off and on incurs an oscillator start-up delay, which lasts microseconds or longer. You can replace the NAND gates with inverters if the enable function is unnecessary.
If the output loading changes during operation, you can take the feedback point from the output to compensate for varying loads. Beware that ringing resulting from poorly terminated transmission lines can cause duty-cycle variations when the feedback comes directly from the output. If minimizing duty-cycle drift is unimportant, feedback is unnecessary, so you can split R3 into a 2.5-kOhm fixed resistor and a 5-kOhm variable resistor that connects to ground. This selection of R3 enables a 25 to 75% duty-cycle adjustment. For different logic families, you must verify, and possible reselect, the gate-bias resistors. ( DI #2254)
You can significantly reduce costs in a single-chip µC application by replacing an external gate with a resistor. In applications that require the gating of an external signal for measurement purposes, the traditional circuit uses an external two-input AND gate (Figure 1a). An I/O line from the µC normally controls one input to the NAND gate, which in turn enables and disables the incoming signal.
Although this circuit is straightforward, the additional overhead of adding an external gate in a single-chip application makes the circuit undesirable. A more elegant and cost-effective gate replaces the AND gate with a resistor, one end of which ties directly to the input and I/O pin (Figure 1b).
To enable the signal to the µC input, the circuit configures the I/O line as an input. This configuration ensures that, during the measurement operation, the I/O line and resistor play no role in the circuit and that the incoming signal passes directly to the µC for measurement.
Configuring the I/O line as an output that's driven either high or low disables the signal, effectively stopping further input to the µC. At this point, the input signal is basically shut off from affecting the measurement. You can repeat the process when another measurement is necessary.
The value of the series resistor determines how much current the I/O pin can source or sink. Because some µCs have a typical sink/source current value as high as 25 mA, the typical minimum resistor value for a 5V system can be 200 Ohm. In most applications, the source that supplies the input signal typically drives about 50 to 10 mA of current. Thus it's best to choose a µC that has a high sink/source capability on the I/O lines, such as one from the PICmicro 8-bit family. (DI #2236)
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