UBM Tech
UBM Tech

ARM TechCon 2013 promises small and large innovations

-October 01, 2013

From tiny devices in the Internet of Things (IoT) to giant server farms, ARM TechCon 2013 is poised to run the gamut of multi-core processing possibilities. Housed in the Santa Clara Convention Center from October 29-31, this year’s conference features keynotes from Bill Veghte, Executive Vice President and General Manager Enterprise Group, Hewlett-Packard Company: The New Style of IT; Simon Segars, Chief Executive Officer, ARM: Transformative technology in the Internet of Things (IoT), data center and mobile; and Dr. Daniel Kraft, MD, Health Science Innovator: The Future of Technology in Health and Medicine: Game-Changing Lessons For Every Industry.

If you are a chip designer, system implementation engineer, or software developer, you will likely be tempted by these conference tracks:
  • Accelerating Hardware Development.
  • Accelerating Software Development
  • Accelerating System Hardware Development
  • Applying New Technologies to New Opportunities
  • Creating the Next Gen Mobile Platform
  • Enhancing the User Experience
  • Marrying Software and Hardware in Multicore Design
  • Maximizing Chip Energy Efficiency
  • Next-Generation Networking – Rise of Software Defined Networking
  • Optimizing System Software Blocks
  • Stacking Up for High Performance Design
  • Taming the IoT Frontier

ARM partners will participate in an exhibition that covers products and applications from mobile and consumer electronics, server and enterprise computing, safety, embedded, software, networking and infrastructure, data security, and IoT. The EXPO hours are Wednesday, October 30: 10:00am – 4:30pm, and Thursday, October 31: 10:00am – 4:00pm.

To learn more about the program, you can check out this video invite from ARM CEO Simon Segars:

[To register for the conference, head here. Use the special promo code: EDN to receive $100 off of an all-access pass.]

If you plan to attend the conference, please comment on what you are most looking forward to. If you wish you could go but cannot, sound off below on what you would like to see. Maybe a fellow engineer can check it out and report back to us?

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