DesignCon 2014 review - part 2

-February 06, 2014

DesignCon is one of the premier gatherings of signal integrity experts and related vendors focusing on high speed signal transmission in circuit boards and systems. This is Part 2 of a review of DesignCon 2014 from and EMC point of view. Deciding to focus more on the EMC aspects of the conference to see what tidbits I could glean. Here are some of the highlights of the show in "slideshow" format. If you missed Part 1, you’ll find it here.

Figure 13 -

There were several papers on EMC that will be available to attendees. Besides my talk, Troubleshooting Radiated Emissions Using Your Own Low-Cost Troubleshooting Kit, Woncheol Baek and Seil Kim (Samsung) did a session on RFI avoidance using on-chip aware simulation in estimating conducted emission. Patrick Casher and Michael Rowlands (Molex) presented EMI analysis of connectors using simulation methods. Norman Chang (Apache Design), Robert Myoung (ANSYS) and Byong-Su Seol (Samsung) presented Chip-Package-System ESD Simulation Methodology Using a Chip ESD Compact Model. Mike Schnecker (Rohde & Schwarz) also presented a unique method of evaluation EMI from SM power supplies using time gating on their oscilloscope.

Enjoy the slide show!

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