ARM develops IP for Common Platform alliance 32-nm, 28-nm nodes

ARM will develop and license a platform of physical intellectual property (IP) for the IBM-led Common Platform alliance as the group moves its SoC work to the 32-nm and 28-nm nodes based on high-k metal-gate technology.

Under the multi-year collaboration, ARM will focus on logic, memory, and interface products for the Common Platform alliance of IBM, Chartered Semiconductor Manufacturing, and Samsung Electronics. The IP will target optimal power, performance, and area, and will be available for distribution to the trio's customers.

ARM further plans to develop customized physical IP targeted for its current and future Cortex processor family and the Common Platform high-k metal-gate 32-nm/28-nm technology.
 
“Through this early engagement, we are creating the foundation for designing power-efficient ARM SoCs for customers of the Common Platform,” said Warren East, ARM's CEO, in a statement this morning. “By utilizing the strength of our advanced microprocessors, our leadership in physical IP design and advanced technology supported by the Common Platform, customers can accelerate the release of products for electronic devices that service a broad range of consumer applications.”

After IBM and Chartered began trading resources in 2002, the Common Platform was formed as a manufacturing collaboration focused on bulk CMOS 90-nm process technologies. Combining the expertise and research resources of the three companies and by leveraging such advancements as high-k metal-gate technology, 193-nm immersion lithography, and ultra-low-k dielectrics, the alliance now has development collaboration planned through 22-nm processes. As described by IBM, the Common Platform model allows foundry customers to source their chip designs to multiple 300-mm foundries with minimal design work.

“IBM remains convinced collaborative innovation in an open ecosystem of partners is the key to technology leadership, both now and in the years to come,” said Mike Cadigan, general manager of IBM's semiconductor solutions business, in the statement. “Today’s announcement with ARM extends that strategy to the next level, from IBM research through Common Platform manufacturing to the leading consumer application architecture.”

The Common Platform partners expect to continue to expand the initiative beyond ARM to include members in the areas of EDA support, services, and IP offerings in the near term. 

ARM has also offered 65-nm and 45-nm IP for Common Platform technology.