KLA-Tencor hones litho/etch process control

-March 04, 2013

Two new tools from KLA-Tencor—the SpectraShape 9000 optical critical-dimension metrology system and the BDR300 backside-defect inspection and review module—enable volume production of integrated circuits at sub-20-nm design rules.
The products help manufacturers deal with tight process tolerances in lithography and etch by focusing on two key issues: scanner focus-related defects and failure or underperformance of finFETs, vertically stacked NANDs, and other three-dimensional structures caused by small deviations in shape.

The SpectraShape 9000 introduces a laser-driven plasma light source that has higher intensity and lower noise than its predecessor. It also employs several optical techniques that enable the measurement of a broad range of materials and complex device structures.

The BDR300 backside inspection and review module for the CIRCL cluster tool also improves defect sensitivity over its predecessor, allowing fabs to find and classify sub-micron backside defects. The CIRCL cluster is now available as a stand-alone backside inspection and review system.

SpectraShape 9000 metrology system product page

CIRCL cluster tool product page

KLA-Tencor, www.kla-tencor.com

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