Design Con 2015

Subminiature backplane handles increased RF content

-June 18, 2013

The RF DIN 1.0/2.3 modular backplane system from Molex enables PCB developers in the video, commercial broadcast, and telecommunications industries to transfer multiple RF signals across mated boards in a single assembly, while the use of DIN 1.0/2.3 connectors permits dense packing. In addition, a modular, bracketed housing allows expansion of the backplane system to 10 RF ports for increased orthogonal PCB mating.

The board-to-board system has a frequency range from DC to 3 GHz, a working voltage rating of 250 V RMS, and nominal impedance of 75 Ω. Configuration options include a standard 4-port, 75-Ω version or customizable versions with 6, 8, or 10 ports and 50-Ω impedance. The DIN 1.0/2.3 interface allows up to 1 mm of axial engagement tolerance. Connectors feature a push-pull coupling design for quick installation and a plastic housing that engages before RF contact to prevent damage from stubbing.

RF DIN 1.0/2.3 modular backplane assembly

Molex, www.molex.com

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