Packaging Technology

Semiconductor Packaging Technology is a 2 day course that offers detailed instruction on the technology issues associated with today’s semiconductor packages.

Location: Tel Aviv, Israel
Date: 8/3/2008 - 8/4/2008
Organizer: Semitracks Inc.

Semiconductor Packaging Technology is a 2 day course that offers detailed instruction on the technology issues associated with today’s semiconductor packages. We place special emphasis on current package technology issues like polymers, lead-free solders, low-k dielectrics, and tools for package analysis. This course is a must for every manager, engineer, and technician working in semiconductor packaging, using semiconductor components in high performance applications or non-standard packaging configurations, or supplying packaging tools to the industry. Participants learn basic but powerful aspects about the semiconductor packaging. This skill-building series is divided into five areas:
1. Packaging Technology Overview
2. Current Issues
3. Materials for Packaging
4. Package Reliability and Characterization Techniques
5. Future Semiconductor Packages

Event Link:http://www.semitracks.com/courses/packaging-tech-course.htm