Packaging Design

Semiconductor Packaging Design is a 3-day course that offers detailed instruction on the design and modeling of semiconductor packages.

Location: Tel Aviv, Israel
Date: 8/5/2008 - 8/7/2008
Organizer: Semitracks, Inc.

Semiconductor Packaging Design is a 3-day course that offers detailed instruction on the design and modeling of semiconductor packages. We place special emphasis on package interactions with the die. This course is a must for every manager, engineer, and technician working in semiconductor packaging, using semiconductor components in high performance applications or non-standard packaging configurations, or supplying packaging tools to the industry. Participants learn basic but powerful aspects about the semiconductor packaging. This skill-building series is divided into four segments:
1. Packaging Design Overview
2. Mechanical Simulations
3. Thermal Simulations
4. Modeling Semiconductor Packages

Event Link:http://www.semitracks.com/courses/packaging-design-course.htm