Advanced Thermal Management and Packaging Materials Course

Advanced materials are becoming critical for today’s microelectronic systems. As new, more powerful chip designs are introduced, they consume more power.

Location: Munich, Germany
Date: 9/15/2008 - 9/17/2008
Organizer: Semitracks, Inc.

Advanced Thermal Management and Packaging Materials is a 3 day course that covers the large and increasing number of advanced thermal management materials, and provides an in-depth discussion of properties, manufacturing processes, applications, cost, lessons learned, typical development programs, and future directions. Traditional materials are discussed for reference. Participants are invited to bring their thermal management problems for discussion. This course is designed for every manager, engineer and technician concerned with packaging materials, using semiconductor components or supplying tools to the industry.

Event Link:http://www.semitracks.com/courses/advanced-materials-course.htm