JEDEC Partner Programs at CES 2009

Session Title: The Future of Flash Memory Products With speakers from Intel, Micron, Microsoft, Nokia, Qualcomm, Seagate and Samsung Session Title: Understanding Moisture/Reflow Sensitivity for IC Packages: Achieving Pb-free Assembly Classification and Handling Instructor: Jack McCullen, Intel

Location: Las Vegas, NV
Date: 1/8/2009 - 1/8/2009
Organizer: JEDEC

Flash Memory in Consumer Products:
Flash Memory has countless applications across the mobile and PC markets, and JEDEC’s session at CES is the place to hear about all of them from industry insiders. Speakers from Intel, Micron, Microsoft, Nokia, Qualcomm, Seagate and Samsung will lead discussions about the impact of NAND Flash on consumer products, as well as current and future applications for Solid State Drives, Universal Flash Storage, e-MMC embedded memory storage cards and more.

Understanding Moisture/Reflow Sensitivity for IC Packages:
Successful implementation of Pb-free electronics assembly processes is an ongoing challenge for the industry. Proper classification, handling, shipping and use of moisture-sensitive components are critical for reliable products. JEDEC’s course at CES, facilitated by Jack McCullen of Intel, addresses the impact of Pb-free assembly on moisture-sensitivity classification and provides background information on moisture/reflow effects. J-STD-020, J-STD-033 and J-STD-075, the leading industry specifications for detailing proper moisture/reflow sensitivity procedures and classification, will be reviewed in detail.

Event Link:Emily Desjardins