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1 - 10 of about 3568 results

Circuit protection basics - Part 2: Case study - understanding and using predictive analysis

Article Source: EDN | Date: 2012-02-07T21:21:35Z
.... Over time, the reputation of highly protected electronic equipment will be associated with longevity and reliability, making consumers realize that products aren't necessarily poorly or cheaply...
http://www.edn.com/article/520839-Circuit_protection_basics_Part_2_Case_study_understanding_and_using_predictive_analysis.php

2012 ACE Awards Ultimate Products: Development kits, reference designs, and SBCs

Article Source: EDN | Date: 2012-02-06T06:59:00Z
...2012 ACE Awards Ultimate Products: Development kits, reference designs, and SBCs...
http://www.edn.com/article/520799-2012_ACE_Awards_Ultimate_Products_Development_kits_reference_designs_and_SBCs.php

2012 ACE Awards Ultimate Products: Passive components, sensors, indicators, and interconnects

Article Source: EDN | Date: 2012-02-06T06:43:00Z
.... The voting deadline is February 24.We will announce the winners March 27 at a cocktail reception in San Jose during DESIGN West. Tickets to the event are available. See www.ubm-ace.com for additional information.ADL5811/ADL5812 wideband passive mixers, Analog Devices IncWireless receiver designers typically have had to choose between an active mixer, which offers excellent wideband operation and moderate...
http://www.edn.com/article/520797-2012_ACE_Awards_Ultimate_Products_Passive_components_sensors_indicators_and_interconnects.php

2012 ACE Awards Ultimate Products: SOCs

Article Source: EDN | Date: 2012-02-06T06:05:00Z
... the winners March 27 at a cocktail reception in San Jose during DESIGN West. Tickets to the event are available. See www.ubm-ace.com for additional information.Wide I/O memory controller design IP, Cadence Design SystemsThe Cadence wide I/O interface not only meets the performance requirements dictated by the Wide I/O memory interface standard in review at JEDEC but also includes unique optimizations...
http://www.edn.com/article/520783-2012_ACE_Awards_Ultimate_Products_SOCs.php

Kodak's travails provide multiple lessons

Article Source: EDN | Date: 2012-02-02T08:00:00Z
... a basic camera, you wouldn’t buy anything else from the company.The lesson is that disruptive technologies truly are so, and most companies can’t—or shouldn’t—make that transition. In the electronics world...
http://www.edn.com/article/520715-Kodak_s_travails_provide_multiple_lessons.php

Intel muscles into smartphones, tablets

Article Source: EDN | Date: 2012-02-02T08:00:00Z
... company will be getting the validation it has long sought as a player in the wireless industry.“When great silicon and software technology meets great mobile and design innovation, amazing things can happen...
http://www.edn.com/article/520742-Intel_muscles_into_smartphones_tablets.php

Single-chip, nine-axis INU targets consumer devices

Article Source: EDN | Date: 2012-02-02T08:00:00Z
... Nasiri, chief executive officer and founder of Invensense. “The MPU-9150 motion-tracking module will be a boon to any consumer motion-processing application, from location-based services to gesture recognition,” he says.The product combines the MPU-6050 gyroscope chip with the AKM8975 magnetometer from AKM (Asahi Kasei Microdevices) Corp. The 3-D chip stack includes an ASIC containing the electronics...
http://www.edn.com/article/520761-Single_chip_nine_axis_INU_targets_consumer_devices.php

Power MOSFETs continue to evolve, thanks to wafer thinning and innovative packaging

Article Source: EDN | Date: 2012-02-02T08:00:00Z
... first proposed the design approach in the DrMOS-driver specification, but the concept’s high cost and complexity hindered its adoption. Increases in power density now make the paired-switch technology...
http://www.edn.com/article/520673-Power_MOSFETs_continue_to_evolve_thanks_to_wafer_thinning_and_innovative_packaging.php

CEA-Leti opens 3-D IC packaging service

Article Source: EDN | Date: 2012-02-01T08:16:00Z
... companies and niche market manufacturers and integrators," said Laurent Malier, CEO of Leti.CEA-Leti has worked with ST-Ericsson, STMicroelectronics and Cadence Design Systems Inc. on the creation...
http://www.edn.com/article/520752-CEA_Leti_opens_3_D_IC_packaging_service.php

ARM tips 'gods and giants' roadmap

Article Source: EDN | Date: 2012-01-31T17:19:44Z
...-end processing cores. Atlas and Apollo will implement the ARMv8-A architecture which supports 64-bit computing. The chips are being designed for likely implementation in 20-nm manufacturing process technology...
http://www.edn.com/article/520736-ARM_tips_gods_and_giants_roadmap.php


1 - 10 of about 3568 results

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