EDN Asia  |  EDN China  |  EDN Japan  |  EDN Europe  |  EDN Australia

Category:
Digital SOC IP

Nominee:
WINNER: Dynamic Point-to-Point (DPP) technology (Rambus)

One of the most frustrating roadblocks today's engineers face is balancing the necessary trade-offs between memory performance for capacity and expandability. Rambus' DPP (Dynamic Point-to-Point) technology is designed to eradicate performance deficiencies inherent in previous approaches.

The DPP inventors anticipated the future direction of the market and implemented high-speed, differential signaling. DPP technology allows designers to maximize memory capacity without compromising the signal integrity benefits of point-to-point signaling.

DPP technology allows PCs or home servers to utilize a single memory module at full bandwidth (left side of the diagram), but with an option for a second module upgrade on a fixed datapath (right side of the diagram). This enables an 8× increase in memory bandwidth compared with previous technologies for consumer, multimedia, and computing systems—all while supporting traditional modules and new application form factors.

DPP brings serial-link data rates to standard low-cost systems. Once memory speeds surpass 1 GHz, routing data buses to multiple memory modules creates a bottleneck. DPP allows memory to operate at a much faster speed.

The technology was first showcased in XDR memory, which began mass production this year. A single XDR memory-enabled XDIMM module provides 12.8 to 25.6 Gbytes/sec of peak memory bandwidth using just 32 data signal pairs, and supports between two and 18 DRAM devices.

ADVERTISEMENT

More information on EDN's Innovation Awards

   

2005 Innovation Awards Sponsors


Platinum:

Avnet


Gold:  

CadenceXXXXNational InstrumentsXXXXRambusXXXXSilicon LaboratoriesXXXXMaestro Public Relations and Marketing


Silver:

Fujitsu

International Engineering Consortium

Kontron

Synplicity

Xilinx


ABOUT EDN  |  FREE SUBSCRIPTIONS  |  CONTACT US


1997- 2009 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this web site is subject to its Terms of Use | Privacy Policy