Sigrity introduces cost-savvy power-decoupling-capacitor tool for PCB and package design
By Michael Santarini, Senior Editor -- 3/12/2007
One of the longest running problems in PCB (printed-circuit-board) design has been trying to figure how much decoupling capacitors you need for your design. PCB engineers often use too much decoupling capacitance to ensure that their designs will achieve power stability requirements of their system and still meet performance goals. But each decoupling capacitor adds extra cost to the design, and typical designs have a lot of unnecessary capacitance.
Addressing this problem, Sigrity Inc recently introduced a smart decoupling-capacitance tool that helps users place just enough capacitance in their designs to reduce costs and still meet performance goals. The company’s new OptimizePI targets PCB and package decoupling capacitance (see figure). The tool’s inputs are a user-customizable library and the layout of the design. Users select the best candidates for their designs from the library and then direct the tool to analyze the layout. “The tool selects at each location what is the best capacitor they should choose from the library,” says Jiayuan Fang, president of Sigrity. “The tool does a large-scale statistical analysis and automatically tries a lot of schemes. The tool then automatically places the appropriate decoupling capacitance where it is needed on the board based on performance and cost constraints. Given target performance, this tool will automatically find what is the lowest cost.”
The tool has a what-if capability that allows users to test capacitors for the right balance of performance and cost. “It adds a new dimension of automation for because you are able to stabilize your power-delivery system and achieve a performance level at a much reduced cost,” says Teo Yatman, vice president of business development.
Fang also claims that, because the tool is highly automated, you need no power-integrity-engineering expert to run it. He notes that designers can use the tool during several steps in the PCB- and package-development process. For example, they can use it during design to figure out the lowest cost configuration and to get a better idea of open board real estate, during layout to implement the best configuration after placing the other components in the design, and even during manufacturing if other more inexpensive units become available or if a previously targeted unit becomes unavailable.
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