Samsung, Siltronic open 300-mm Singapore fab

By Ann Steffora Mutschler, Senior Editor -- 6/20/2008

Following a $1 billion investment by partners Samsung Electronics Co Ltd and Siltronic AG, the 300-mm joint venture fab in Singapore, Siltronic Samsung Wafer Pte Ltd, officially started operation this week.

Samsung and Wacker Chemie AG subsidiary Siltronic announced their plans originally in July 2006 and this week’s opening comes just 18 months after construction of the fab began with a target monthly capacity of 300,000 wafers by 2010. The companies also noted that the factory will build up to employ more than 800 workers by that time.

Oh-Hyun Kwon, president of Samsung Electronics’ semiconductor business said in a statement, “The new 300-mm wafer fabrication plant is a result of the strong local support from Singapore’s Economic Development Board and the technology expertise of our partner, Siltronic.”

“Together with Siltronic, Samsung anticipates Siltronic Samsung Wafer to play a significant role as a steady source of quality 300-mm wafers at a time of rapid growth in the 300 mm wafer market segment,” he added.

Singapore's Prime Minister Mr. Lee Hsien Loong who was on-hand at the opening ceremony said the factory will extend Singapore’s semiconductor value chain, and bring the country to the next level of wafering technology. “The long-term prospect for the semiconductor industry remains bright and Singapore has positioned itself to take full advantage of this and remain a leading manufacturing location in Asia for electronics and semiconductors,” he noted.

Siltronic Samsung Wafer is believed to be the first 300-mm wafer production fab in Singapore, and houses Singapore’s first 300-mm crystal growing facility, the parent companies noted.

The production complex is located in Tampines Industrial Park in Singapore, built with the support of the Economic Development Board of Singapore, and making it one of the top five investments in Singapore in 2006.

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