Hynix completes Cheongju 300-mm fab construction

By Ann Steffora Mutschler, Senior Editor -- 9/1/2008

Hynix Semiconductor Inc said late last week that it has completed the construction of M11, its third factory in Cheongju, Korea, which contains 300-mm wafer fabrication facilities in its two-story structure.

For more on fab spending, see:

Fab spending to hit bottom by Q4, rebound in 2009, SEMI says

ADVERTISEMENT
SEMI: Fab spending to dip 15% in 2008

Construction began with the groundbreaking in April 2007, and is built on the total site of 108,697 square meters including 294,637 square meters building and area, located close to where Hynix operates manufacturing facilities. Hynix said it expects the factory to leverage the workforce and infrastructure of other plants in Cheongju.

M11 is scheduled to begin production of approximately 40,000 wafers per month in September and will exclusively fabricate Hynix’s most advanced high-density NAND Flash products including 16Gb, 32Gb flash memory using 40-nm level process technology. The capacity of the fab will be increased as dictated by market need. The total capacity of the fab is 200,000 wafers per month.

“Hynix plans to develop Cheongju site as the number one NAND Flash manufacturing facilities in the world starting from this completion of the third factory construction. Though recovery of the semiconductor industry has been in delay, we will continuously secure competitiveness and growth engine for sustainable growth with our leading-edge technologies and active strategic alliances,” added Jong-kap Kim, chairman and CEO of Hynix, in a statement.


© 2009, Reed Business Information, a division of Reed Elsevier Inc. All Rights Reserved.