Novellus, UAlbany launch $20M R&D partnership

By Suzanne Deffree, Managing Editor, News -- 7/14/2009

The College of Nanoscale Science and Engineering (CNSE) at the University at Albany and Novellus Systems Inc have formed a $20 million partnership to conduct next-generation R&D in sub-22nm semiconductor manufacturing technology.

As part of the agreement, the equipment supplier will install three advanced thin-film deposition tools -- a VECTOR plasma-enhanced chemical vapor deposition system, a SABRE copper electrochemical deposition system, and an ALTUS tungsten chemical vapor deposition system -- at CNSE's Albany NanoTech complex.

Further, a team of Novellus researchers will be located with CNSE staff at Albany NanoTech. The team will conduct research into advanced nanofabrication processes including copper fill for interconnects, copper through-silicon via fill for 3-D packaging applications, tungsten deposition for transistor contacts, and thin dielectric film deposition.

"Novellus Systems is pleased to engage in this next-generation research and development program in collaboration with the College of Nanoscale Science and Engineering," said Tom Caulfield, Novellus executive VP of sales, marketing, and customer satisfaction, in a statement. "Combining the technological expertise of Novellus, with the intellectual know-how and assets of CNSE, will accelerate the development of innovations needed to drive our industry forward."

The agreement between Novellus and CNSE also includes the potential for future R&D initiatives that may involve the location of additional Novellus employees and tools at CNSE's Albany NanoTech, San Jose-based Novellus said.

In March, CNSE announced a $150 million expansion that would bring some 600 new jobs to the area.  That followed an announcement by long-time CNSE partner IBM on the 22-nm front. Tokyo Ohka Kogyo Co and Sematech are also working at CNSE on 22-nm technologies.

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