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Distributors look to shine with HB-LED opportunity 6/26/2008
HB LEDs (high-brightness light-emitting diodes) hold great opportunity for the electronics supply chain and are particularly attractive to distributors, as the technology will require full-system approaches from suppliers and manufacturers. Analysts estimate that general illumination, signs and displays, and automotive applications will push HB LEDs' high-growth opportunities for driver ICs fr...ROHS DecaBDE exemption ending 6/26/2008
After a challenge from Denmark and the European Parliament, the European Commission-granted EU ROHS (European Union restriction-of-hazardous-substances) exemption for DecaBDE (decabromodiphenyl ether) will end on July 1. DecaBDE is a common flame retardant used in various components and electronics, including HIPS (high-impact-polystyrene) enclosures, polyethylene-wire insulation, and PBT (poly...Cadence's beat 12/18/2007
Electronic News/EDN recently sat down with Mike Fister, president and CEO of Cadence Design Systems Inc. and the former senior VP and general manager of Intel Corp.'s enterprise platforms group, to discuss the EDA industry, work across the capital-equipment value chain, and life after Intel.Inside Intel: Where next? 10/23/2007
In this second of two parts, Dadi Perlmutter, senior vice president and general manager of Intel’s Mobility Group, sounds off on the company’s plans to expand the Intel Architecture into new markets and the developments that will play a key role in making that happen.Special Report: Inside Intel 10/16/2007
First of two parts: The world's biggest processor maker takes aim at data centers and consumer electronics with its new low-power chips and on-board graphics. Pat Gelsinger, senior vice president and general manager of Intel's Digital Enterprise Group, sat down with Electronic News to talk about the company's new target markets, integrated graphics and the next big thing.AMD’s new vision 9/14/2007
Hector Ruiz, chairman and CEO of Advanced Micro Devices, discusses the company’s new quad-core Barcelona server chip, the future of AMD’s business and its forthcoming push into the consumer electronics world.Tougher choices in capital equipment 8/17/2007
Executive Insight: Rick Hill, chairman and CEO of Novellus, talks about what’s changing in capital equipment, why there won’t be any new competitors and why it may cost more for companies to develop manufacturing processes.Partnering to make room for maximum value-add 7/27/2007
Executive Insight: Dr. Hans Stork, CTO and senior VP of silicon technology development at Texas Instruments, discusses the company’s decision to outsource its process development, how decisions are made about which foundry to use, the power of semiconductor manufacturing equipment suppliers and the positive impact that foundries have had on the industry as a whole.How the biggest get bigger 7/13/2007
Applied Materials' CEO sounds off on where to find new opportunities outside of the box and how the company is leveraging its expertise in thin films into everything from solar to RFIDs and potato chip bags.IBM Inside 6/15/2007
Special Report: In the first of two parts, IBM Chief Technologist Bernard Meyerson points a spotlight at the company's Airgap technology, the resurgence of mainframes and Intel’s recent statements.ADVERTISEMENT
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