Executive Q&A

Voices: NXP’s René Penning de Vries: Moving beyond Moore 7/23/2009

René Penning de Vries, senior vice president and chief technology officer of NXP, spoke to EDN about how design and R&D is changing as we evolve passed the traditional definitions of Moore’s Law and into a new era based on value-added applications and guided more than ever before by economics.

Atotech joins Sematech’s 3D interconnect program 4/16/2009

Sematech's 3D interconnect program gains Atotech copper electroplating of TSVs to the consortium's pool of expertise.

EDN names winners of 19th Annual Innovation Awards 3/31/2009

EDN has bestowed its 19th Annual Innovation Awards, honoring a diverse group of electronics engineers and the ground-breaking products they have produced. The Altera Stratix IV 40-nm FPGA design team is named Innovator of the Year. Read on for a complete list of the winners.

IBM, ITRI explore solid state "racetrack memory" 9/17/2008

IBM Corp. said today that it has started joint development work with Taiwan-based Industrial Technology Research Institute (ITRI) to explore an approach to solid state memory called "racetrack memory," which was conceived by IBM Fellow Dr. Stuart Parkin at IBM's Almaden Research Center in San Jose, Calif.

AMD updates Stream software development kit 8/6/2008

To help increase the ease and efficiency of software development using its Stream processing approach, Sunnyvale, Calif-based microprocessor challenger Advanced Micro Devices Inc is announcing an extensive upgrade for future versions of its Stream software development kit, meant to reduce the time and effort needed to produce GPU accelerated applications that run on multiple platforms.

ASML boosts immersion litho performance 7/15/2008

Aimed at 38-nm memory and 32-nm logic semiconductor high-volume manufacturing, Veldhoven, the Netherlands-based lithography giant ASML Holding NV today rolled out its Twinscan XT:1950i lithography system that uses a 1.35 numerical aperture lens, which the company claims increases the performance of its immersion chip lithography systems by 25% by improving overlay, resolution and throughput.

Silicon Genesis’ “kerf-free” wafering technology reduces amount of polysilicon for PV apps 7/11/2008

Meant to substantially reduce the amount of polysilicon used within the ingot-to-wafer manufacturing steps and eliminate some of the costly consumables in today’s wafer manufacturing, San Jose-based semiconductor, display, optoelectronics, and solar engineered substrate process technology provider Silicon Genesis Corp has produced solar substrates for photovoltaic applications using its “kerf-free” wafering process technology called PolyMax.

Voices: Synopsys’ Aart de Geus on investing to win 6/12/2008

EDA leader discusses 'Frankenstein' flows, multicore trends, and the economy's impact on IC design.

Direct-write e-beam system shows major promise for volume production 5/30/2008 7:00:00 PM

In a paper delivered at the International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication, eShuttle lifts the curtain on a technology shift that could take the e-beam technology far beyond the world of prototyping.

IMEC, Renesas research reconfigurable RF transceivers 5/28/2008

Renesas has joined IMEC's software defined radio front-end program to research new technologies for multi-standard RF transceivers and early realization of next-generation mobile phones.

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