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Hard-disk drive touts 2-Tbyte storage, speedier spins 9/3/2009

Last month, I believed that Western Digital was still the only vendor manufacturing 2-Tbyte, 3.5-in. hard-disk drives in high volumes. As it turns out, I wasn’t exactly right; Seagate recently began selling a 2-Tbyte member of its Barracuda LP family.

Intel introduces speedy, inexpensive, 34-nm solid-state drives 8/20/2009

Although Intel and Micron’s IM Flash Technologies partnership last November announced mass production of 34-nm lithography-based, 32-Gbit MLC (multilevel-cell) NAND-flash memories, Intel fabricated its first generation of MLC-derived solid-state drives, along with their SLC (single-level-cell) siblings, on 50-nm ICs.

DAC shapes sound for small speakers 7/23/2009

Wolfson Microelectronics’ new single-chip, monophonic WM9081 DAC and speaker amplifier deliver optimum sound-pressure levels and maximum intelligibility from low-cost speakers, such as those in portable navigation devices, mobile handsets, digital radios, and conference speakerphones. The IC has a high-efficiency, 2.

Memcon panel explores readiness of DDR3 6/29/2009

Chips are shipping, but questions remain about the ramp of the new DRAM standard.

Voices: Is multimedia abandoning DSPs? Analog Devices disagrees 5/28/2009

Denis Labrecque, marketing-programs manager at Analog Devices, sounds off on DSPs’ past, present, and future in audio, graphics, and imaging.

EDN names winners of 19th Annual Innovation Awards 3/31/2009

EDN has bestowed its 19th Annual Innovation Awards, honoring a diverse group of electronics engineers and the ground-breaking products they have produced. The Altera Stratix IV 40-nm FPGA design team is named Innovator of the Year. Read on for a complete list of the winners.

Companion processor supports video editing on the phone 2/19/2009

Semiconductor start-up Movidia has announced the MA1110 multimedia processor for mobile phones. The MA1110 operates as an attached processor to the baseband or to another applications processor in medium- to high-end phone designs to enable high-performance in-phone-video postproduction in real time on low power budgets.

ISSCC papers look toward high-definition in your handset 1/2/2009

An early look at papers to be presented at the 2009 ISSCC this February suggest the imminent arrival of high-definition video in your hand. Underlying technology in broadband communications to support the demanding data stream are now in silicon, and a new generation of HD-targeted media SOCs is making its debut. Real HD in handsets—whatever the practicality of the medium in this format may turn out to be—cannot be far behind.

Tzero promises demo of 1080p60 wireless HDMI using UWB 12/3/2008

UWB (ultrawideband) silicon provider Tzero Technologies today announced that it plans to demonstrate at a developer's conference in Japan this week a "commercially viable" UWB implementation capable of delivering a 1080-line, 60-frame/sec HDTV signal.

Avnet, TI, and Xilinx deliver FPGA/DSP development board for digital video 10/31/2008

Avnet, Texas Instruments, and Xilinx today announced the availability of the Avnet Spartan-3A DSP DaVinci Development Kit, an aptly (albeit cumbersomely) named development board that combines a Xilink Spartan-3A FPGA with a TI media-processor DSP for digital-video applications including automotive systems, machine vision, and surveillance.

Slimmer light guide heralds ultrathin-LCD panels 10/16/2008

Philips Research recently displayed a prototype of a 32-in. LCD television that measures only 8 mm thick—about 20% as thick as the slimmest commercially available panels. The key to the skinny design is a 1-mm-thick light-guide plate that uses patented technologies to uniformly distribute light from high-power, energy-efficient LED backlights.

Android phone announced, platform expected to gain 4% of US Q4 smartphone share 9/23/2008

The Google branding behind T-Mobile's G1 Android-based smartphone will only take it and the platform so far, analysts say, noting Open Handset Alliance's late entrance into an already crowded market and possible operator subsidies issues for Android-based phones.

Innovation-aid software gets infusion of 1.3 million IEEE documents 8/20/2008

Invention Machine has announced the addition of 1.3 million technical documents from the IEEE (Institute of Electrical and Electronics Engineers) to its Goldfire Innovator software tool.

Intel turbo charges future Core processors 8/20/2008

IDF: Intel showed off its next-generation desktop PC chips -- Intel Core i7 processors -- and energy-efficient, high-performance server products, codenamed “Nehalem-EP,” that will be moved into production in Q4. Intel also said it is planning a second server derivative aimed at the expandable sever market, codenamed “Nehalem-EX”, along with desktop and mobile client versions in the second half of 2009.

ITC upholds Broadcom patent-infringement claim against SiRF 8/11/2008

As it did in Round One, Broadcom has prevailed in Round Two of a GPS patent dispute with SiRF Technology, as a US ITC (International Trade Commission) judge Friday ruled that SiRF products infringe six patents belonging to Global Locate, a wholly owned Broadcom subsidiary.

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