EDN has bestowed its 19th Annual Innovation Awards, honoring a diverse group of electronics engineers and the ground-breaking products they have produced. The Altera Stratix IV 40-nm FPGA design team is named Innovator of the Year. Read on for a complete list of the winners.
Semiconductor start-up Movidia has announced the MA1110 multimedia processor for mobile phones. The MA1110 operates as an attached processor to the baseband or to another applications processor in medium- to high-end phone designs to enable high-performance in-phone-video postproduction in real time on low power budgets.
An early look at papers to be presented at the 2009 ISSCC this February suggest the imminent arrival of high-definition video in your hand. Underlying technology in broadband communications to support the demanding data stream are now in silicon, and a new generation of HD-targeted media SOCs is making its debut. Real HD in handsets—whatever the practicality of the medium in this format may turn out to be—cannot be far behind.
UWB (ultrawideband) silicon provider Tzero Technologies today announced that it plans to demonstrate at a developer's conference in Japan this week a "commercially viable" UWB implementation capable of delivering a 1080-line, 60-frame/sec HDTV signal.
Avnet, Texas Instruments, and Xilinx today announced the availability of the Avnet Spartan-3A DSP DaVinci Development Kit, an aptly (albeit cumbersomely) named development board that combines a Xilink Spartan-3A FPGA with a TI media-processor DSP for digital-video applications including automotive systems, machine vision, and surveillance.
Philips Research recently displayed a prototype of a 32-in. LCD television that measures only 8 mm thick—about 20% as thick as the slimmest commercially available panels. The key to the skinny design is a 1-mm-thick light-guide plate that uses patented technologies to uniformly distribute light from high-power, energy-efficient LED backlights.
The Google branding behind T-Mobile's G1 Android-based smartphone will only take it and the platform so far, analysts say, noting Open Handset Alliance's late entrance into an already crowded market and possible operator subsidies issues for Android-based phones.
Invention Machine has announced the addition of 1.3 million technical documents from the IEEE (Institute of Electrical and Electronics Engineers) to its Goldfire Innovator software tool.
IDF: Intel showed off its next-generation desktop PC chips -- Intel Core i7 processors -- and energy-efficient, high-performance server products, codenamed “Nehalem-EP,” that will be moved into production in Q4. Intel also said it is planning a second server derivative aimed at the expandable sever market, codenamed “Nehalem-EX”, along with desktop and mobile client versions in the second half of 2009.
As it did in Round One, Broadcom has prevailed in Round Two of a GPS patent dispute with SiRF Technology, as a US ITC (International Trade Commission) judge Friday ruled that SiRF products infringe six patents belonging to Global Locate, a wholly owned Broadcom subsidiary.
Santa Clara, Calif-based chip giant Intel Corp will present a paper at the Siggraph 2008 conference being held next week in Los Angeles that details features and capabilities for its forthcoming multi-core “Larrabee” architecture which includes a new approach to the software rendering 3-D pipeline, a many-core programming model and performance analysis for several applications.
Long-awaited consolidation among global UWB (ultrawideband) standards took a big step forward today with the announcement that the WiMedia Alliance and Swiss-based standards development consortium Ecma International will collaborate on future UWB standards.
The group will explore what kinds of standards will be required in order to ensure interoperability of 3-D content across diverse delivery media and consumer storage and playback devices.