Business Center
News
Semiconductor equipment bookings flat, book-to-bill ratio remains above 1.0 11/20/2009
SEMI reports that although the book-to-bill ratio for October slipped from September's results, the semiconductor industry continues its slow recovery.Mentor joins SOI Industry Consortium 11/13/2009
In joining the group, the company aims to expand EDA tool and methodology support for SOI (silicon-on-insulator) technology.Elpida outsources to Winbond in DRAM manufacturing partnership 11/11/2009
The outsourcing agreement pertains to the supply of GDDR3 and GDDR5 graphic DRAMs for Elpida and is the first step in a broader business partnership the two companies intend to pursue.Cree plans LED facility in China 11/9/2009
The 592,000-square-foot facility in Huizhou will be Cree’s first chip-production facility outside of North America and is targeted to also house future components manufacturing expansion.Freescale puts two fabs up for sale 11/9/2009
ATREG has been appointed as advisor to Freescale in the sale of the company's two operational 150-mm semiconductor manufacturing facilities.Ruiz to leave GlobalFoundries 11/3/2009
Hector Ruiz, chairman of the AMD manufacturing spin-off, has taken a leave of absence amid insider trading allegations and will officially resign in January.Agilent teams with Stanford for nanoscale devices 10/28/2009
Agilent Technologies is collaborating with Stanford University in a research program designed to explore a new class of nanoscale devices using a combinations of the SPM (scanning probe microscope) and ALD (atomic layer deposition).Applied opens solar research facility in China, says it is largest non-government solar energy research facility in the world 10/26/2009
The Applied center is comprised of laboratory and office buildings covering more than 400,000-square feet and contains an Applied SunFab thin-film manufacturing line and a complete crystalline silicon pilot process.SEMI: Bookings rise y/y for first time since May 2007, industry continues to improve 10/21/2009
North America-based manufacturers of semiconductor equipment posted $732.8 million in orders last month and an improved book-to-bill ratio of 1.17, according to SEMI's September book-to-bill report.UMC moves Singapore fab to 45-/40-nm manufacturing 10/9/2009
UMC noted growing customer demand for leading edge capacity and expansion of the company's market share for advanced process technologies as its reasons behind the migration.TSMC, IMEC team for 'more-than-Moore' platform 10/7/2009
IMEC and TSMC forge an Innovation Incubation Alliance, focused on moving emerging "more-than-Moore" technology options from design to manufacturing to product stages.ARM, GlobalFoundries partner on 28-nm HKMG for Cortex-A9 10/6/2009
With the agreement, GlobalFoundries said it will be the first foundry to work with ARM to enable a 28-nm Cortex-A9 SOC solution.IMEC targets design program at fabless/fab-lite, foundries, EDA vendors 10/5/2009
The nanoelectronics and nanotechnology research center launches an industrial affiliation program on designing with emerging technologies.IMEC claims major step toward 3D integration of DRAM on logic 9/30/2009
According to IMEC, the 3D stack resembles future commercial chips as close as possible, consisting of a 25µm thick logic die on top of which a commercial DRAM is stacked using TSVs (through-silicon vias) and micro-bumps.Low cost manufacturing in North America: An alternative to Asia 9/29/2009
GUEST OPINION: In comparison to China, Mexico has emerged as a “best cost country” for products destined for the United States and global markets. The reasons are relatively straight forward.ADVERTISEMENT
About Us | Contact Us | Free Email Newsletters | Free Magazine Subscription | Advertising | 
RSS
©1997-2009 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy