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Ruiz to leave GlobalFoundries 11/3/2009
Hector Ruiz, chairman of the AMD manufacturing spin-off, has taken a leave of absence amid insider trading allegations and will officially resign in January.Agilent teams with Stanford for nanoscale devices 10/28/2009
Agilent Technologies is collaborating with Stanford University in a research program designed to explore a new class of nanoscale devices using a combinations of the SPM (scanning probe microscope) and ALD (atomic layer deposition).Applied opens solar research facility in China, says it is largest non-government solar energy research facility in the world 10/26/2009
The Applied center is comprised of laboratory and office buildings covering more than 400,000-square feet and contains an Applied SunFab thin-film manufacturing line and a complete crystalline silicon pilot process.SEMI: Bookings rise y/y for first time since May 2007, industry continues to improve 10/21/2009
North America-based manufacturers of semiconductor equipment posted $732.8 million in orders last month and an improved book-to-bill ratio of 1.17, according to SEMI's September book-to-bill report.UMC moves Singapore fab to 45-/40-nm manufacturing 10/9/2009
UMC noted growing customer demand for leading edge capacity and expansion of the company's market share for advanced process technologies as its reasons behind the migration.TSMC, IMEC team for 'more-than-Moore' platform 10/7/2009
IMEC and TSMC forge an Innovation Incubation Alliance, focused on moving emerging "more-than-Moore" technology options from design to manufacturing to product stages.ARM, GlobalFoundries partner on 28-nm HKMG for Cortex-A9 10/6/2009
With the agreement, GlobalFoundries said it will be the first foundry to work with ARM to enable a 28-nm Cortex-A9 SOC solution.IMEC targets design program at fabless/fab-lite, foundries, EDA vendors 10/5/2009
The nanoelectronics and nanotechnology research center launches an industrial affiliation program on designing with emerging technologies.IMEC claims major step toward 3D integration of DRAM on logic 9/30/2009
According to IMEC, the 3D stack resembles future commercial chips as close as possible, consisting of a 25µm thick logic die on top of which a commercial DRAM is stacked using TSVs (through-silicon vias) and micro-bumps.Low cost manufacturing in North America: An alternative to Asia 9/29/2009
GUEST OPINION: In comparison to China, Mexico has emerged as a “best cost country” for products destined for the United States and global markets. The reasons are relatively straight forward.TI opens 300-mm analog manufacturing facility in Texas, adds up to 1000 jobs 9/29/2009
TI claims the Richardson, Texas, fab will be the world’s only production facility to use 300-mm to manufacture analog chips. CEO Rich Templeton describes the 250 open positions as "high-quality, well-paying engineering, manufacturing, and administrative jobs." When fully operational, TI said the fab may employ as many as 1000 people.'Swift recovery under way' with shortages possible, analyst reports 9/16/2009
July IC sales and unit volume numbers prompted IC Insights to report that a "swift" recovery and "V-shaped" rebound are under way in the semiconductor industry, but to also state that shortages are possible, as are sharp increases in average selling prices.IC capacity utilization expected to make come back in Q3 9/9/2009
IC Insights reports that little capex spending will contribute to an upward trend through 2010, bringing rising average selling prices as a result.MEMC plans 540 job cuts, US plant closure in effort to save $55M a year 9/8/2009
MEMC Electronic Materials will cease production of silicon crystal ingots and wafers at facilities in Sherman, Texas, and St Peters, Mo. MEMC also revises its Q3 estimates after a disruption in production at its polysilicon facility in Pasadena.Fab spending expected to grow 64% in 2010 9/4/2009
SEMI forecasts increased fab spending for 2010 but says capacity will stay stagnant.ADVERTISEMENT
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