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Voices: Leveling the playing field for small hardware start-ups 10/22/2009
Chumby designer Andrew Huang is among the first of a new breed of small-hardware-system entrepreneurs using China's electronics supply chain.Cadence links FPGA-pin allocation to PCB-layout tools 10/8/2009
Co-design solution speeds designing FPGAs onto PCB systems.High hot/cold factor boosts HB-LED efficacy 10/8/2009
Philips’ new Luxeon Rebel HB LEDs (high-brightness light-emitting diodes) have a 0.93 hot/cold factor—the ratio of junction temperatures at 100 and 25°C.Touch sensors allow for variations in parasitic capacitance 6/23/2009
Capacitive-touch sensors can detect a finger touch by measuring capacitive changes on the touch pad.Ramtron expands serial-FRAM line with 32-kbit device 6/19/2009
Ramtron International Corp, a supplier of nonvolatile FRAM (ferroelectric random-access memory), has announced the FM24CL32, a serial-nonvolatile RAM that offers high-speed read/write performance, low-voltage operation, and long-term data retention.MEMS-based motion sensors move lower in both size and price 6/9/2009
The 16-bit, three-axis LIS302DLH digital MEMS (microelectromechanical-system) accelerometer from STMicroelectronics is 0.75 mm high and has a 335-mm footprint. It has a power-saving shutdown mode and wakes automatically when it detects motion.LED-metal substrates get sticky with thermally conductive adhesive 4/24/2009
Bergquist has introduced its Bond Ply 450 thermal-interface material, which eases heat removal from LED assemblies when you combine it with the company’s Thermal Clad metal substrate.EDN names winners of 19th Annual Innovation Awards 3/31/2009
EDN has bestowed its 19th Annual Innovation Awards, honoring a diverse group of electronics engineers and the ground-breaking products they have produced. The Altera Stratix IV 40-nm FPGA design team is named Innovator of the Year. Read on for a complete list of the winners.LED chip sets help pico projectors bring big displays to small devices 2/13/2009
Bourns hot-dips trimmers to eliminate tin whiskers 2/12/2009
Tin whiskers—electrically conductive, crystalline structures that grow from surfaces on which tin is the final finish—have been the bane of electronic products since 2007.Germanium-on-insulator materials have high hole mobility 2/5/2009
As device designers look beyond 22 nm, it is becoming clear that we are simply running out of carrier mobility. Strain engineering has helped a lot. By applying physical strain to the channel of a MOSFET, you can significantly increase the carrier mobility—enough at even 45 nm to make up for many of the other shortcomings of the device and end up with reasonable current.Nonmagnetic-connector family suits MRI equipment 1/16/2009
MRI (magnetic-resonance imaging) uses a powerful magnetic field to create an image of what’s happening under a patient’s skin.Future nonvolatile memories may have carbon footprints 1/8/2009
A Rice University team has proposed that a strip of graphene 10 atoms thick could serve as the basic storage element in a new form of memory. With individual bits smaller than 10 nm, the memory’s capacity would improve upon today’s state-of-the-art flash memory by a factor of five when comparing 2-D arrays.Flared-pin heat sinks use natural convection to cool "green" applications 1/5/2009
Cool Innovations has introduced a line of flared-pin fin heat sinks featuring an array of sparsely configured round pins that slant outward, a configuration that cools components in natural convection environments.Tiny lens harnesses oscillating water droplets 10/16/2008
From cell phones to military drones, many applications demand small, light optical lenses but can’t spare much power for focusing them. Researchers at Rensselaer Polytechnic Institute claim to have developed an innovative liquid lens that fits the bill.ADVERTISEMENT
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