News

MEMS-based motion sensors move lower in both size and price 6/9/2009

The 16-bit, three-axis LIS302DLH digital MEMS (microelectromechanical-system) accelerometer from STMicroelectronics is 0.75 mm high and has a 335-mm footprint. It has a power-saving shutdown mode and wakes automatically when it detects motion.

LED-metal substrates get sticky with thermally conductive adhesive 4/24/2009

Bergquist has introduced its Bond Ply 450 thermal-interface material, which eases heat removal from LED assemblies when you combine it with the company’s Thermal Clad metal substrate.

EDN names winners of 19th Annual Innovation Awards 3/31/2009

EDN has bestowed its 19th Annual Innovation Awards, honoring a diverse group of electronics engineers and the ground-breaking products they have produced. The Altera Stratix IV 40-nm FPGA design team is named Innovator of the Year. Read on for a complete list of the winners.

LED chip sets help pico projectors bring big displays to small devices 2/13/2009

Bourns hot-dips trimmers to eliminate tin whiskers 2/12/2009

Tin whiskers—electrically conductive, crystalline structures that grow from surfaces on which tin is the final finish—have been the bane of electronic products since 2007.

Germanium-on-insulator materials have high hole mobility 2/5/2009

As device designers look beyond 22 nm, it is becoming clear that we are simply running out of carrier mobility. Strain engineering has helped a lot. By applying physical strain to the channel of a MOSFET, you can significantly increase the carrier mobility—enough at even 45 nm to make up for many of the other shortcomings of the device and end up with reasonable current.

Nonmagnetic-connector family suits MRI equipment 1/16/2009

MRI (magnetic-resonance imaging) uses a powerful magnetic field to create an image of what’s happening under a patient’s skin.

Future nonvolatile memories may have carbon footprints 1/8/2009

A Rice University team has proposed that a strip of graphene 10 atoms thick could serve as the basic storage element in a new form of memory. With individual bits smaller than 10 nm, the memory’s capacity would improve upon today’s state-of-the-art flash memory by a factor of five when comparing 2-D arrays.

Flared-pin heat sinks use natural convection to cool "green" applications 1/5/2009

Cool Innovations has introduced a line of flared-pin fin heat sinks featuring an array of sparsely configured round pins that slant outward, a configuration that cools components in natural convection environments.

Tiny lens harnesses oscillating water droplets 10/16/2008

From cell phones to military drones, many applications demand small, light optical lenses but can’t spare much power for focusing them. Researchers at Rensselaer Polytechnic Institute claim to have developed an innovative liquid lens that fits the bill.

Slimmer light guide heralds ultrathin-LCD panels 10/16/2008

Philips Research recently displayed a prototype of a 32-in. LCD television that measures only 8 mm thick—about 20% as thick as the slimmest commercially available panels. The key to the skinny design is a 1-mm-thick light-guide plate that uses patented technologies to uniformly distribute light from high-power, energy-efficient LED backlights.

Elpida, Qimonda may set up joint manufacturing activities 8/8/2008

Following Elpida Memory Inc’s announcement this week that it plans to set up a 300-mm wafer fab in China with a venture investment group that leverages technology created jointly with Qimonda AG, the Munich, Germany-based memory company is confirming that the two are continuing to discuss manufacturing partnership options. iSuppli Corp, which ranks Elpida and Qimonda as third and fifth largest DRAM makers, is predicting more turbulent times ahead for DRAM.

Miniature photocoupler features high-speed isolated switching 8/7/2008

Toshiba Electronics Europe has launched the TLP117 miniature photocoupler for applications requiring a combination of isolation, high-speed data transfer, and low-power operation.

Avnet inks HB-LED-focused distribution agreement 8/7/2008

Avnet Electronics Marketing and the Avnet LightSpeed team will work with customers on the application of Nuventix’s HB-LED-focused technology by offering specialized engineering and system-level design assistance

Infineon, STATS ChipPAC, STMicroelectronics to develop wafer-level-packaging standard 8/7/2008

Targeting the manufacture of future-generation semiconductor packages, STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG said today that they have agreed to jointly develop the next-generation of embedded wafer-level ball grid array technology, based on Infineon’s first-generation technology.

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