| INTRODUCTION |
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A special supplement to EDN
Published March 19, 2009
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Obstacles and opportunities
By Rick Nelson, Editor-in-Chief
The current political and economic environment presents some roadblocks to innovation in our industry, but it presents many opportunities as well. |
| INNOVATOR OF THE YEAR FINALISTS |
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Bringing giant FPGAs to a new node
By Ron Wilson, Executive Editor
Altera Corp's design team for its 40-nm Stratix IV FPGA provides an example of the huge amount of work it takes to be the first to use a new process. |
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Embedded instruments target product life cycle
By Rick Nelson, Editor-in-Chief
EDN Innovator of the Year finalist Glenn Woppman describes technologies and partnerships that validate the embedded-instrumentation concept for chips, boards, and systems. |
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A focus on reducing power consumption in DSPs
By Robert Cravotta, Technical Editor
Octasic's Opus asynchronous architecture addresses power consumption for multicore DSP applications. |
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Teamwork makes challenging design task feasible
By Ron Wilson, Executive Editor
The SiGe team wanted to produce an RF-front-end module using the best technology for each component but still remaining cost-competitive with monolithic approaches. |
| FEATURES |
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It’s time for innovation to go beyond the technical
By Ron Wilson, Executive Editor
Now is the time for lateral thinking, not for reflexive conservatism. But lateral thinking means unprecedented sharing of information among engineering, financial, and corporate management. And it means resisting that reflex to pull back when the unknown yawns before us. |
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Life after layoffs: How to move forward after a job loss
By Suzanne Deffree, Managing Editor, News
With the number of job cuts continuing to rise and competition for open positions becoming more intense by the week, industry experts and career strategists share their advice on continuing an engineering career after being laid off. |
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