In-Depth Technical Features

"I'd like to buy a µ": the 36th annual microprocessor directory
By Robert Cravotta, Technical Editor, 10/22/2009
Don't take a chance on your processor selections. The recently updated directory provides details on hundreds of processors and cores from more than 70 vendors.

Debugging FPGA designs may be harder than you expect
By Chris Schalick, GateRocket, 10/22/2009
Bugs can originate at every stage in the FPGA design flow; debugging success depends on using the right tools and methods.

Using high-current integrated-switch power-regulator ICs
By Frederik Dostal, National Semiconductor, 10/22/2009
Learn the thermal considerations so you don't get burned.

Specify an external reference clock to improve SERDES performance
By Shawn Logan, LSI Corp, 10/21/2009
Various serial data standards require different clock specifications.

Implementing an all-digital PHY and delay-locked loop for high-speed DDR2/3 memory interfaces
By Luigi Ternullo, Virage Logic, 10/15/2009
A new, all-digital approach to implementing high-speed PHY logic and a DLL offers a path to addressing increasingly stringent market requirements.

Designing an accessible board
By Ron Wilson, Executive Editor, 10/8/2009
Design in access to verification and debugging during—not after—the development of a board-level product.

Comparing comparators: Measure signals, get results
By Paul Rako, Technical Editor, 10/8/2009
Simple in concept, voltage comparators have myriad specifications that complicate their application.

IP quality lies beyond compliance testing
By Navraj Nandra, Synopsys Inc, 10/8/2009
Of course you want your standard-interface IP to pass compliance testing. But that accomplishment is just the beginning. Complete quality assurance for IP cores has far more challenges.

Deep packet inspection optimizes mobile applications
By Mike Coward, Continuous Computing, 10/8/2009
Mobile data provides a notable growth opportunity for cellular operators, but adoption will be slow unless networks can provide good service to all subscribers. Deep packet inspection enables operators to understand the applications their subscribers are using and to build appropriate networks.

A new set of Sallen-Key filter equations
By Martin Cano, National Semiconductor, 10/1/2009
New design equations let you pick equal capacitor values and solve for the resistors to achieve any desired gain in one stage.

FPGA architectural power-saving techniques at 40 nm
By Seyi Verma, Altera Corp, 9/23/2009
As geometries shrink, FPGAs must begin to employ design-specific power-management techniques in order to save power while meeting timing.

RF switching options: The right fit might come with a loss
By Rick Nelson, Editor-in-Chief, 9/17/2009
Manufacturers are offering SOI and MEMS alternatives to PIN-diode, GaAs, and electromechanical switches for a variety of RF applications, but you need to understand RF-switch specs before you commit to a new technology.

Breaking down the sensor-signal path
By Aaron GL Podbelski, Cypress Semiconductor, 9/17/2009
By understanding the stages of an analog-signal path, digital-system developers can more accurately capture sensor data for a variety of applications.

In search of a better DRAM: evolving to floating bodies
By Serguei Okhonin, PhD, Innovative Silicon, 9/17/2009
Widely investigated floating-body memories appear to be compelling replacements for conventional DRAMs. A new floating-body memory uses the intrinsic bipolar transistor to store significantly greater charge.

Thermal design guidelines for solid-state lighting applications using LEDs
By Henry F. and Peter A. Villaume, Villaume Associates, 9/11/2009
Here are six critical steps necessary to developing a successful, cost-effective thermal design for an LED application. Two families of LED applications have been used to illustrate many of the design choices that are open to the thermal designer to satisfy these application issues.

Draw the line: Isolation shields systems from shocking surprises
By Paul Rako, Technical Editor, 9/3/2009
You must design isolation into your circuits if you want to ensure user safety, eliminate ground loops, and reduce noise. Before selecting a technology, make sure that you understand all the specs and design considerations.

Outsourcing an IC design: Some advice from the trenches
By Ron Wilson, Executive Editor, 9/3/2009
In this climate, outsourcing is becoming a mandatory skill for IC-design managers. But it's not intuitively obvious.

Characterizing noise in high-performance voltage-reference ICs
By Jim Williams, Linear Technology Corp, 9/3/2009
Measuring the noise performance of a modern voltage reference requires special measurement techniques.

Hands-on project: Transporting high-def video broadcasts: Are wireless networks up to the task?
By Brian Dipert, Senior Technical Editor, 8/20/2009
High-resolution video-streaming support is supposedly a key justification for 802.11n versus its 802.11a and 802.11b/g predecessors. So why doesn't it deliver on its promises?

Take advantage of open-source hardware
By Gerald Coley, Texas Instruments, 8/20/2009
Basing your product on a reference design or demo board can speed time to market.

Addressing interleaved multichannel memory challenges
By Drew E Wingard, PhD, Sonics Inc, 8/20/2009
Interleaving addresses in multiple DRAM channels can greatly improve memory bandwidth, but it is not a trivial task.

Implementing power factor correction with frequency clamp critical conduction mode
By Patrick Wang, ON Semiconductor, 8/19/2009
An innovative power factor correction design, frequency clamp critical conduction mode, clamps the frequency with a near-unity power factor while keeping the simple control scheme of a critical conduction mode design.

Use simultaneous-sampling ADCs to monitor three-phase ac line power
By Martin Mason, Maxim Integrated Products, 8/18/2009
Multichannel simultaneous-sampling analog-to-digital converters trim your costs while simplifying power-monitoring systems.

Hands-On Project: Speaking of porting software
By Robert Cravotta, Technical Editor, 8/6/2009
This software-porting hands-on experiment uncovers a potential audio decoder for embedded-system applications, adding audio or speech to the applications' user interfaces.

Ambient-light sensors pack in features to help applications get smarter, greener
By Margery Conner, Technical Editor, 8/6/2009
Ambient-light sensors help smartphones conserve display power and improve battery runtime. Newer versions combine improved features, such as spectral response and dynamic range, integrated proximity, and digital communications. These features are readying the sensors for use in large-screen and automotive displays and solid-state lighting.

IMS highlights student ingenuity
By Jennifer Kempe, Contributing Editor, 8/6/2009
Competitions drive student interest in microwave theory and techniques.

DRAM technology for SOC designers and—maybe—their customers
By Drew E Wingard, PhD, Sonics Inc, 8/6/2009
An understanding of DRAM technology has become critical to anyone designing consumer-electronics SOCs.

First-pass success in silicon packaging
By Javier DeLaCruz, eSilicon Corp, 8/6/2009
Package issues interact with all aspects of the design flow, from chip architecture to manufacturing decisions.

Techniques for implementing high-performance processor cores
By Gregory Schulte and Vamsi Boppana, 8/6/2009
Every step of the integration process gives the design team opportunities to move closer to its design goals.