Press Releases

All Releases

• Custom Design Automation Leader Pulsic Granted Patent For Routing According To Current Density Rules
  Source: Pulsic Ltd, 7/2/2009
  Optimal Net Widths Achieved Through Automatic Routing Leads to Lower IR losses, Elimination of Electro-Migration Issues, and Smaller Designs
• UAV reliability and weight improvements delivered by Wire in Composite
  Source: BERU f1systems, 7/2/2009
  New embedded wiring technology prototype increases reliability, durability and package space for unmanned aerial vehicles
• DSPCon Introduces DataFlex-515 Ultra-Portable, Battery-Powered Data Recorder with Standard Real-Time Analysis Software; Company Also Announces GSA Listing of DataFlex-1000/1000A Recorders
  Source: DSPCon, Inc., 7/1/2009
  DSPCon, Inc., has launched the latest addition to its performance-proven line of data recorders, the DataFlex-515. The Company's DataFlex-1000/A Series has also been GSA listed.
• Verification Special Session at DAC 2009 to Discuss Advances in Debugging
  Source: OneSpin Solutions, 7/1/2009
  Experts from Intel, Jasper, OneSpin and the Universities of Tokyo, Toronto and Michigan to Explore ‘The Tool Shows That My Design is Wrong, But Where is the Bug?’
• iNEMI Members Release Position Statement on the Definition of “Low Halogen” for Electronic Products
  Source: iNEMI (International Electronics Manufacturing Initiative), 7/1/2009
  Members of iNEMI have released a position statement that defines "low halogen" (BFR/CFR/PVC-free) for electronic products. The objective is to encourage consensus on a common definition of maximum halogen levels for components and materials to enable development of compliant material sets.
• Broadcast Video Test Equipment Leader PHABRIX Selects National Semiconductor’s 3-Gbps SDI Family
  Source: National Semiconductor, 6/30/2009
  Award-Winning Portable Signal Analyzer Delivers Best-in-Class Jitter Performance and Optimizes Configurability
• IME launches 10th Electronic Packaging Research Consortium to Address 3-Dimensional Integrated Circuits
  Source: Institute of Microelectronics, 6/30/2009
  The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced the launch of the 10th Electronic Packaging Research Consortium (EPRC-10) to address key integration challenges of 3-dimensional (3-D) Packaging and Embedded Module technologies during a signing ceremony.
• LEDs Color Historic Light-Art Concert with Future Lighting Solutions
  Source: Future Lighting Solutions, 6/30/2009
  170 Balloons Changed Color to Match Music’s Mood & Tempo
• IDT Introduces New Family Of Versaclock™ Timing Devices
  Source: Integrated Device Technology, 6/30/2009
  New Timing Devices Offer Greater Flexibility and Improved Performance for Designers of High-Performance Consumer, Telecommunications, Networking and Data Communications Applications
• RTI Gears Up to Address DDS Market Growth
  Source: RTI, 6/30/2009
  New Field Operations organization enhances delivery of RTI expertise