Press Releases

All Releases

• 4ipnet Unveils EAP300 3x3 MIMO 11n Access Point with Proprietary Press-n-Connect Technology
  Source: 4ipnet, Inc., 11/24/2009
  Not just a standard 11n access point: 4ipnet EAP300 is empowered by 4ipWES (Press-n-Connect) technology; to establish a connection between two of more access points are just a few steps. The dual-band EAP300 can operate on PoE and targets customers in need of wireless solutions to replace traditional Ethernet networks.
• FCI Offers Pwr Profile+™ Cable Assemblies for Low-Profile Power Applications
  Source: FCI, 11/24/2009
  FCI, a leading developer of connectors and interconnect systems, announces Pwr Profile+™ low profile I/O cable assemblies.
• Stackpole's Thin Film Resistors for Telecom Applications
  Source: Stackpole Electronics, 11/24/2009
  Ideal for telecommunication applications, Stackpole Electronics' RNCP Series thin film resistors provide twice the normal power rating compared to standard thick film technology.
• NOVELLUS¡¦ ASHABLE HARDMASK (AHM™) PECVD FILMS ENABLE SUB-32nm LITHOGRAPHIC PATTERNING
  Source: Novellus, 11/24/2009
  Up to 7 Percent Device Yield Improvement Achievable Compared to Traditional Amorphous Carbon Films
• Power Integrations Releases New Version of PI Expert(R) Power Supply Design Software
  Source: Power Integrations, 11/24/2009
  Version 7.1.5 optimizes transformer design for improved efficiency, accurately calculates external resistor requirements, and includes traditional Chinese language support
• Ares introduces Oracle ERP for Taiwan IC design house UTC
  Source: Ares International Corp., 11/24/2009
  Ares International Corp. has signed contract with Unisonic Technologies Company Limited (UTC), a major Taiwan-based supplier of high-tech semiconductor devices and IC design, for introducing Oracle ERP for the IC designer. The system is expected to go live next April.
• Fast cure, no mixing, superior performance encapsulant from Intertronics
  Source: Intertronics, 11/24/2009
  Intertronics’ latest introduction to the world of electronic encapsulants is the Multi-Cure® 9001-E series which addresses the age old problems of time and mess/mixing with consummate success.
• ON Semiconductor Introduces GreenPoint® Reference Designs for High Efficiency LED Lighting Applications
  Source: On Semiconductor, 11/24/2009
  Reference designs simplify development of MR16 format products and LED-based ENERGY STAR® residential luminaires
• Hirose Electric Develops FPC-to-Board Connectors with 0.6mm Stacking Height, 0.4mm Contact Pitch
  Source: Hirose Electric, USA, 11/23/2009
  Versatile connector features multiple stacking heights; highly reliable contact and retention force…
• Hynix Standardizes on Magma's FineSim Pro and FineSim SPICE for Full-Chip Verification of Large Memory Designs
  Source: Magma Design Automation, 11/23/2009
  Advanced Circuit Simulation Products Proven to Deliver 4 Times Faster Performance Without Sacrificing Accuracy