Essential news, analysis, and insight for the day-to-day operation of semiconductor fab lines, foundries, and chip-assembly operations, plus the business of designing, developing, manufacturing, selling, and marketing ICs. en-us http://www.edn.com/community/47047/Semiconductor+Manufacturing.html Copyright 2009 Reed Business Information. Subject to its Terms of Use (http://www.edn.com/index.asp?layout=page&module=terms) Sun, 22 Nov 2009 02:08:32 PDT http://www.reed-electronics.com/electronicnews/article/CA6708251.html?rssid=244 SEMI reports that although the book-to-bill ratio for October slipped from September's results, the semiconductor industry continues its slow recovery. Fri, 20 Nov 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6707042.html?rssid=244 In joining the group, the company aims to expand EDA tool and methodology support for SOI (silicon-on-insulator) technology. Fri, 13 Nov 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6706685.html?rssid=244 The outsourcing agreement pertains to the supply of GDDR3 and GDDR5 graphic DRAMs for Elpida and is the first step in a broader business partnership the two companies intend to pursue. Wed, 11 Nov 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6706222.html?rssid=244 The 592,000-square-foot facility in Huizhou will be Cree’s first chip-production facility outside of North America and is targeted to also house future components manufacturing expansion. Mon, 09 Nov 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6706231.html?rssid=244 ATREG has been appointed as advisor to Freescale in the sale of the company's two operational 150-mm semiconductor manufacturing facilities. Mon, 09 Nov 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6705189.html?rssid=244 Hector Ruiz, chairman of the AMD manufacturing spin-off, has taken a leave of absence amid insider trading allegations and will officially resign in January. Tue, 03 Nov 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6704249.html?rssid=244 Agilent Technologies is collaborating with Stanford University in a research program designed to explore a new class of nanoscale devices using a combinations of the SPM (scanning probe microscope) and ALD (atomic layer deposition). Wed, 28 Oct 2009 00:00:00 PDT http://www.edn.com/article/CA6704016.html?rssid=244 A presentation at the recent ARM Developers' Conference reveals the extent to which library developers will shield chip designers from the challenges of 32-nm lithography. Tue, 27 Oct 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6703855.html?rssid=244 The Applied center is comprised of laboratory and office buildings covering more than 400,000-square feet and contains an Applied SunFab thin-film manufacturing line and a complete crystalline silicon pilot process. Mon, 26 Oct 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6703279.html?rssid=244 North America-based manufacturers of semiconductor equipment posted $732.8 million in orders last month and an improved book-to-bill ratio of 1.17, according to SEMI's September book-to-bill report. Wed, 21 Oct 2009 00:00:00 PDT http://www.reed-electronics.com/eb-mag/article/CA6701633.html?rssid=244 The challenges of manufacturing in China and the still recovering global economy cause electronics supply chain jitters among OEMs and encourage second looks at the shift to outsource and the potential benefits of keeping manufacturing closer to home. Tue, 13 Oct 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6701214.html?rssid=244 UMC noted growing customer demand for leading edge capacity and expansion of the company's market share for advanced process technologies as its reasons behind the migration. Fri, 09 Oct 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6700795.html?rssid=244 IMEC and TSMC forge an Innovation Incubation Alliance, focused on moving emerging "more-than-Moore" technology options from design to manufacturing to product stages. Wed, 07 Oct 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6700550.html?rssid=244 With the agreement, GlobalFoundries said it will be the first foundry to work with ARM to enable a 28-nm Cortex-A9 SOC solution. Tue, 06 Oct 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6700320.html?rssid=244 The nanoelectronics and nanotechnology research center launches an industrial affiliation program on designing with emerging technologies. Mon, 05 Oct 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6699424.html?rssid=244 According to IMEC, the 3D stack resembles future commercial chips as close as possible, consisting of a 25µm thick logic die on top of which a commercial DRAM is stacked using TSVs (through-silicon vias) and micro-bumps. Wed, 30 Sep 2009 00:00:00 PDT http://www.reed-electronics.com/electronicnews/article/CA6699257.html?rssid=244 TI claims the Richardson, Texas, fab will be the world’s only production facility to use 300-mm to manufacture analog chips. CEO Rich Templeton describes the 250 open positions as "high-quality, well-paying engineering, manufacturing, and administrative jobs." When fully operational, TI said the fab may employ as many as 1000 people. Tue, 29 Sep 2009 00:00:00 PDT http://www.reed-electronics.com/eb-mag/article/CA6699180.html?rssid=244 GUEST OPINION: In comparison to China, Mexico has emerged as a “best cost country” for products destined for the United States and global markets. The reasons are relatively straight forward. Tue, 29 Sep 2009 00:00:00 PDT