www.your_instrument.com By Dan Strassberg, Senior Technical Editor
Just as it has already done in so many areas, technology developed for the Internet is starting to transform instrument interfacing. Test and measurement will never be the same.
FROM EDN EUROPE: Automotive design sets RTOS cost and performance
challenges By David Marsh, Contributing Technical Editor
Continually tightening "green" legislation and increasing consumer sophistication are driving up in-vehicle-electronics content. As stand-alone systems mature into distributed network-based architectures, developers need environments and tools that meet hard real-time requirements.
Design Features
Little ICs, big display voltages By Bill Travis, Senior Technical Editor
Display-driver ICs cut the time and effort it takes to design drive and control circuitry for high-voltage displays.
Perk up productivity with profiling tools NS Manju Nath, Technical Editor
Debugging and optimizing today's 32-bit embedded applications is becoming increasingly difficult. Now, designers of embedded systems are relying more on software-profiling techniques to optimize and debug the code.
A Verilog programming-language-interface primer Swapnajit Mittra, SGI
If you design in Verilog, using the HDL's programming-language interface is valuable for invoking a C function from Verilog. This article provides the information you need to start writing useful PLI routines.
DDR-SDRAM, high-speed, source-synchronous interfaces create design
challenges Hansel A Collins and Ronald E Nikel, TriCN Associates LLC
Constantly increasing system-performance expectations are outstripping the capabilities of traditional synchronous interfaces. Source-synchronous-interface alternatives provide additional bandwidth head room but require more careful design analysis and implementation.
Wideband-CDMA-system design becomes more complex D Coons, Frontier Design Inc, and J Oba, Hewlett-Packard Co
Wideband CDMA offers flexibility for a variety of services. The system-level design of a wideband-CDMA physical layer benefits from modeling and simulating various system elements, including DSP and RF components.
Heat-sink-attachment methods optimize thermal performance Christopher Soule, Aavid Thermal Technologies Inc
A number of attachment options exist for interfacing a heat sink to a device. Before selecting an interface mode, however, you must consider the system's configuration, method of board assembly, and thermal requirements.
