Contents

February 3, 2005

Issue Cover Image

Cover Story


Design Features

  • Making the move to serial buses

    Serial-bus architectures offer high performance and system scalability. Understanding how they operate is the first step in managing the transition away from parallel-system-bus designs.
  • Reducing audio "buzz" in GSM cell phones

    The pulse rate for GSM is within the audio band, and the dc current and RF energy readily convert into an objectionable audio "buzz" within the phone's circuitry. You can minimize the buzz if you take precautions early in the design stage.
  • Microelectronics applications require the right stacked-memory-packaging architecture

    It's sometimes difficult to achieve a distinctive combination of memory chips to support high data performance, low power consumption, low cost, and high-volume production to meet consumers' needs.
  • S-parameters and digital-circuit design

    As bus speeds move into the microwave range, digital designers need thorough knowledge of S-parameters.
  • FROM EDN EUROPE: LIN simplifies and standardises in-vehicle networks

    The exponential growth of electronic subsystems within vehicles demands application-specific networking topologies that range from the mission critical to the mundane. Embodying experience from more complex protocols, LIN tackles low-end applications with a comprehensive design-flow methodology.



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