Contents
July 6, 2006
Cover Story
- 100-Mbps broadband: how, why, when, and where?
A triple play of voice, video, and data moves the bandwidth target as consumers adopt HDTV and DVR technologies and demand more content choices.
Design Features
- Is chip design different after 90 nm?
Design teams find that success requires some fundamental changes in thinking and in team structure in the 90- and 65-nm processes. - Isolating USB
With isolation, the USB fits a whole new crop of applications. - Reducing ground bounce in dc/dc-converter applications
Electrical ground, which looks simple on a schematic, can become complex depending on how you lay out the pc board. Unfortunately, ground-node analysis is difficult. However, understanding the physics of ground noise helps to reduce the problem. - FROM EDN EUROPE: Thermal therapy
In many applications power density is rising: your design has to remove that heat from the dissipating components and, somehow, conduct it to the ambient environment.
Pulse
- Voices: Pat Gelsinger
- Video op amps exceed HD needs
- LEDs take over in "mood" lighting
- I²C bus now runs at 1 MHz
- FROM EDN EUROPE: Vibration powers wireless sensor
- FROM EDN EUROPE: Agilent updates mid-range logic analysers
- FROM EDN EUROPE: Interface chips extend bus reach, trim jitter
- FROM EDN EUROPE: Virtex 5 unveiled; Altera adds hardware acceleration
- Toshiba spins 200-Gbyte, 2.5-in. hard-disk drive
- Rugged wireless-sensor networks suit harsh industrial environments
- C synthesis tool features larger capacity
- Micron jumps into hybrid-NAND market
- Software optimizes networked-instrument usage
Departments and Columns
- Baker's Best
When is good enough good enough?
- edn.comment
Triple-play roadblocks: technology or competence?
- Prying Eyes
MP3 disassembly: tech for thrifty tune-toters
- Reality Check
Xerox Star: The pioneer always gets the arrows
